Daniel Landherr

Daniel Landherr

Fellow, Electrical Engineering @ Boston Scientific

About

RF Design Technical Lead with experience in RF telemetry and MRI compatibility for implantable medical devices. Broad experience in design, simulation and verification testing of electronic circuits. Strong experience in delivering quality work with a medical device company. Proven ability to deliver a positive financial impact. Experience leading a team of engineers to produce results. Specialties: Antenna and radio frequency circuit design for MICS, SRD, ISM bands. Design verification, quality and reliability testing. RF regulatory standards testing. EMI/EMC. Circuit simulation. Manufacturing and packaging, yield and failure analysis. Strong statistical analysis skills. Six sigma green belt certification. ANSYS HFSS. Soldering and bench testing. Spectrum and network analysis. Antenna design and test. Bluetooth Low Energy.

Country

United States

City

Wyoming

Industry

Medical Equipment Manufacturing

Skill

Radio Frequency (RF) Engineering, System Requirements, Printed Circuit Board (PCB) Design, Hardware

Experience

boston scientific

senior rf design engineer

boston scientific

2008-4 - 2014-3 · 6 年
boston scientific

component engineer

boston scientific

2003-8 - 2008-4 · 4 年 9 个月
emerson

analog asic designer

emerson

2001-9 - 2003-4 · 1 年 8 个月
ibm

project engineer

ibm

1998-5 - 2001-8 · 3 年 4 个月
boston scientific

principal rf design engineer

boston scientific

2014-3 - 至今 · 12 年 8 个月

Education

stewartville senior high

stewartville senior high

georgia institute of technology

georgia institute of technology

2012-1 - 2014-1 · 2 年 1 个月
university of minnesota duluth

university of minnesota duluth

electrical engineering

university of minnesota duluth

university of minnesota duluth

1994-1 - 1998-1 · 4 年 1 个月

Daniel Landherr's Contact Information

Email

******@***.com

Phone

(**) *** ****

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