Wen Chung Lin

Role: Manage engineering team Responsibility: - Coordinate the engineering resource to comply with outside key account customer and inside R&D/sales/production/QA on requirements Achievements: --Set up engineering drawings database on low cost and furthermore benefit for engineering team searching time --Coordinate the sales team and production team to acquire Japan and Italy scooter customer requirements --Improve the customer satisfaction rate from 71% to 89% --Achieve major annual cost down project for above 1000K NTD

-Develop new process on grinding tool product -Achieve daily output target

1. Duty Project Manager (Dec2012~Nov 2013) Role: Equipment integration project leader Responsibility: Monitor the equipment release status of 5 factories between China and Taiwan Evaluate the new equipment on production efficiency and product efficiency Handle pending equipment issue Achievements: --Improve the equipment release rate from 35% to 90% --Solve pending equipment issue by integrate with ME/procurement/legal 2.Duty ME Manager (Dec2011~Nov 2012) Role: Manage ME team Responsibility: Machine downtime rate control New production line expanding project Achievements: --Machine down time rate to below 5% --Expand and set up the new equipment to new production line by around 2 times on time 3. Duty IQC Manager (Dec2010~Nov 2011) Role: Manage internal IQC team Responsibility: Cross department wafers quality monitor Achievements: --Improve the poor wafer misjudge rate from 7% to 1% --Set up and release new AOI high quality machine to sort out high risky wafers 4. Duty wafer process Manager (Dec2008~Nov 2010) Role: Manage wafer process team Responsibility: Improve the wafer yield Cost down Trouble shooting Achievements: --Yield improvement: improve yield on wafer slicing from 80% to 95% by abrasive and machine capability knowledge --Cost down: Around 1000k NTD on slurry pumping process 5. Cell line and wafer line Senior Process engineer (May 2015~Dec2008) Role: Process optimization Responsibility: Improve the wafer slicing yield Cost down Improve cell line CVD coating yield Achievements: --Yield improvement: improve wafer poor cleaning yield from 15& to 3% --Improve poor CVD coating rate from 10% to 2%

-lead a process and R+M group on Back-end section (BBO, sintering, tumbling, dipping, firing, plating and testing) to achieve daily output and quality goal -Assisted in the new product capacity expansion time to market by equipment installation -addressed customer complaints and process trouble shooting by statistical analysis to problem solving -Transfer new product to mass production include of SOP, Quality verification, BOM

R-Chip/MLCC (passive component ) --Develop new process and technology on miniaturization size product for mobile industry --Launched new MLCC product to market and hit annual goal successfully -Develop end termination technology include Cu material research and firing process investigation