Yasin Kazemi

As a senior hardware design engineer, I specialize in the architecture and implementation of high-speed, multi-layer PCB Design with a strong emphasis on signal and power integrity, EMI/EMC compliance, and simulation-driven design. My core expertise lies in designing boards that meet the highest industry standards (IPC-2221, CE/FCC), with tightly controlled impedance, robust power delivery networks, and reliable performance under demanding conditions. I routinely work across advanced interfaces including DDR4/5, PCIe Gen 3/4/5, USB 3.x, Ethernet, HDMI and SerDes, ensuring compliance through both simulation and real-world validation. My design process blends theoretical precision—rooted in physics and transmission line theory—with hands-on mastery of tools such as: • SI/PI simulation (Sigrity, SIwave, HFSS, ADS) • PCB CAD (Altium Designer, Cadence Allegro/OrCAD) • TDR/VNA measurement, eye diagram analysis, and EMI troubleshooting From stack-up engineering to differential routing, PDN optimization to layout constraints, I focus on building systems that are not only functional, but also optimized for manufacturability, testability, and long-term reliability. Currently open to opportunities across Europe, I aim to contribute to world-class hardware teams tackling cutting-edge, high-performance challenges—where precision, innovation, and deep engineering knowledge make the difference.