Anurag Agrawal
Architect @ Oxmiq Labs
About
As a passionate, innovative, and results-driven technologist focused on solving insurmountable performance and bandwidth challenges in communication and computing, I specialize in moving data / bits efficiently from chip-level intricacies to the expansive scale of data centers. I have a natural curiosity and drive for innovation (29+ granted patents, 2 papers) to deliver outcomes that delight customers. As an integral part of tier-1 VC funded startups from their inception, I’ve led designs of conceptual paper architectures to production, pushing the limits well beyond what was considered possible. E.g., I played a pivotal role in the development of the industry’s first truly programmable 6.5Tb/s Tofino ethernet switch silicon that revolutionized SDN-based networking solutions (2016). With over two decades in semiconductor and computer networking industry I have spearheaded multiple market-leading networking products with unique value propositions. My role has evolved from being hands-on to managing team and driving breakthrough innovation. My areas of expertise involve extensive cross-functional team and it is here that I excel in broad collaboration, influencing strategic decisions, acting as technical expert conduit between execs and ground-level reality enabling the right trade-off decisions, driving customer engagements, and serving as chief problem-solver and dot-connector. I have successfully help resolve team integration challenges during acquisitions, where multiple cultures often clash. In my current role, I have been able to blend my technical expertise, people management skills, and business thinking to drive a major initiative in advance chip development. It is rewarding for me to predict industry inflections and anticipate customer needs 3-5 years hence. I then get deeply involved in driving the introduction of new products that align with these emerging trends. Recently, I drove a new product definition around AI/ML acceleration (Intel SwitchML) for new revenue expansion opportunities. 𝗧𝗲𝗰𝗵𝗻𝗶𝗰𝗮𝗹 𝗘𝘅𝗽𝗲𝗿𝘁𝗶𝘀𝗲 ● Concept-to-tapeout & production SOC development ● Software & hardware co-optimization, PPA, customer usability ● Multi-terabit ethernet networking, Clos fabric topologies, Tofino switches ● Programmable solutions, SDN, PISA & P4 packet forwarding, switching, routing & NICs ● AI/ML collectives, in-network acceleration, TSN, QoS, congestion, telemetry, high-perf packet buffers 𝗘𝘅𝗲𝗰𝘂𝘁𝗶𝘃𝗲 𝗟𝗲𝗮𝗱𝗲𝗿𝘀𝗵𝗶𝗽 ● Strategic direction & technical vision ● Foreseeing trends & leading innovation ● Coach & mentor
United States
Santa Clara
Computer Networking
Product Concept, Technical Requirements, Technical Architecture, Team Leadership, Product Requirements, Problem Solving, Team Management, System Performance, Project Management, Engineering, Build Strong Relationships, Technical Engineering, Negotiation, Technical Direction, Engineering Leadership, Computer Networking, Analytical Skills, ASIC, Hardware Architecture, Algorithms
Experience

Head of Fabric HW Architecture, Switching and Fabric Group
San Francisco Bay Area
As Chief Architect of Tofino Switching silicon, I am leading end-to-end innovation and influencing every aspect of silicon development from concept to tapeout to quality production - Leading silicon architecture of multi-generations of P4 and PISA programmable multi-terabit ethernet networking switches (6.4T-6.5T Tofino, 12.8T-12.9T Tofino2, 25.6T-25.7T Tofino3, ...) - Driving strategic roadmap decisions and customer interactions - Facilitating Build vs Buy, IP vendor selections, technology selection and tradeoffs - Leading pathfinding from concept to approval to unlock new product opportunities - Driving alignment across large organization for product specifications, features & PRD - Strong leadership and interpersonal skills, collaborative team builder, mentor Experience and Expertise: - ASIC development from concept to production silicon with several first pass silicon successes - System, SW and Compiler codesign - Advanced process nodes (TSMC 130nm - 3nm) - Yield & product costs, PPA optimizations - Advanced 2.5D/3D packaging (CoWoS, EMIB) - HSIO (28G NRZ … 224G PAM4), >16GHz Die2Die/UCIe, Bunch-of-wires BoW, - High speed ethernet ports e.g. 50G/100G/400G/800G/1600G - Cu and Optical module (Passive/Active), Co-packaged optics, silicon photonics integration - Scale-out / Scale-up and Clos topologies, Distributed Compute/Memory/Storage architectures - HPC, AI & ML In-network collectives acceleration

Sr Principal Engineer, Switching and Fabric Group (Barefoot Division - Intel acquired 2019)
San Francisco Bay Area
Continued the work of - Barefoot Networks silicon architecture stewardship and innovations - Bringing technical leadership voice to executive team for strategic tradeoffs - Customer and industry trends - Culture ambassador and coach

Director of System Architecture (Formerly Barefoot Networks - startup Founding Architect)
Palo Alto, CA
Extensive experience in semiconductor, frontend ASIC development processes including architecture and design of several networking chips. Experienced in advanced packaging technologies, COT flow and making right tradeoffs for better PPA. Currently Managing, Leading and Defining Barefoot's Legendry Switch ASIC architectures - Current and Future Generations. - Architected the Traffic Manager (TM) with truly Shared data buffer for Tofino2 (12.9Tbps) and Tofino (6.5Tbps) Switch ASICs - Also managed Tofino TM Design, DV and PD teams for successful delivery of TM and Packet Buffer Tofino is TSMC 16nm technology ASIC, working well in customer hands and racking rave reviews everywhere. The Tofino2 is further advance node ASIC with chiplet and advance packaging technologies. Architected the chip to chip link definition and managed/involved the whole development of chiplet and related things. With my startup experiences, can do attitude and drive to learn continuously, I am confident to impact very positively to any ASIC team.

Sr Staff Engineer (ASIC Design)
• Responsible for leading multiple architects/micro-architects on TF (Fabric chip, 2x cores of 64x10G each) chip, foresaw an opportunity to reduce a network-tier and improve system scalability, providing big cost/power benefit to customers through a novel arch pivot to make TF work as a single 128x10G. Developed a simulation model and ran hundreds of scenarios/traffic patterns over two months to guarantee arch. robustness and advantages. Presented to execs. and CTO, resulting in the coveted STAR award recognition, high priority patent, and PoR for next- gen fabric chips. • Led and contributed to variety of silicon (all four in production platforms—MX, QFX) from concept to implementation using TSMC 65-28nm and IBM 90-32nm processes, covering: 250K queues’ HQoS, Chip-to-chip links, high-BW buffers, caches w/atomics, packet parsers & rewrites, etc.

Sr Hardware Design Engineer (11th team member of spin in - Cisco acquired 2006)
Santa Clara, California, United States
Joined at the early stage of the startup as 11th employee. - Rose to lead complete frontend design work within couple of years from a design engineer role - Handled multiple tasks related to front end ASIC development activity including microarchitecture, RTL, Synthesis and interfaced with DV and physical design teams. - Worked closely with architects and custome circuit teams for best product performance ASIC Solution: Industry's First at the time as 36 ports x 10Gbps high perfomance ethernet shared-memory switching datapath solution in TSMC 90nm process. Architecture and designs made into the Cisco's Cat5K products post acquisition.

ASIC Design Engineer
CMOS Chips (and CMOS Soft) Inc
Worked on IP core development for various ASICs.
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