Shuai Meng

Conducted research and development on patterned wafer inspection systems, including optical design, system integration, and performance characterization for high-resolution defect detection.

Led the development of high-precision optical systems, including an alignment system based on infinite conjugate microscope architecture, achieving 0.1 μm resolution through integrated algorithmic enhancement. Designed and assembled multiple microscope setups, performing optical component selection, tolerance analysis, and system integration. Characterized imaging sensors using the EMVA1288 standard, evaluating parameters such as dark noise and PRNU. Developed a micro-angle measurement system using the optical lever principle, reaching 1 μrad angular resolution at 4 kHz sampling rate, with comprehensive error budgeting and mitigation strategies addressing laser fluctuations, mechanical and air vibrations. Contributed to auto-focus sensor development through lens testing, system integration, and performance analysis, and streamlined testing workflows using OpenCV-based image recognition scripts.

Using Zemax and CodeV, designed aspherical plastic lenses for portable devices such as smartphones according to customer requirements. The design process included optimizing lens performance, tolerance analysis, opto-mechanical part design using AutoCAD and Creo, as well as simulating and improving stray light performance. Responsible for failure analysis and continuous improvement of yield in mass production, as well as resolving stray light issues caused by production defects.Familiar with processes for machining aspherical surfaces and coating techniques.