Rex Yu

NPI / JDP with tsmc advance node EPI R&D department

 New process / integration scheme development of power MOS / ssMOS  Project / resource management for new product develop and NPI at foundry site.  Foundry activities: new product release management, new product tapeout, capacity allocation, problem solving, logistics / procurement support and review foundry KPI for new product.

ADVANCED SEMICONDUCTOR MATERIAL TAIWAN – Taichung, Taiwan Principal Field Process Engineer, Jul.2015 ~ Jun.2016  TSMC FAB15 N10/N7 HVM FAB expansion support and lead PEALD process transfer from R&D FAB (HT-SiO / LT-SiO / BSG / PSG / TiO) successfully. ADVANCED SEMICONDUCTOR MATERIAL TAIWAN – Hsinchu, Taiwan Principal Field Process Engineer, Jul.2015 ~ Jun.2016  Lead TSMC F12 N7 R&D penetration project for PEALD LT-SiO application and successfully win the competition.  TSMC FAB12 N10/N7 HVM mini line ramp up support for PEALD process transfer from R&D (HT-SiO / LT-SiO / BSG / PSG / TiO). ADVANCED SEMICONDUCTOR MATERIAL TAIWAN – Tainan, Taiwan Principal Field Process Engineer, Nov.2012 ~ Jul.2015  Lead UMC R&D penetration project of N28 PEALD HT-SiO and successfully win the competition of UMC N28 to get 1st order and repeat order.  UMC FAB12 N14 R&D NPI for PEALD application (SDDP / LT-SiO / BSG / PSG).  TSMC FAB14 N20/N16 HVM FAB expansion support and transfer PEALD process from TSMC F12 R&D FAB successfully.  VDF process support at Mosel. ADVANCED SEMICONDUCTOR MATERIAL TAIWAN – Tainan, Taiwan Principal Field Process Engineer, Feb.2012 ~ Nov.2012  Lead VDF R&D penetration project of PERC solar cell at Motech.  Successfully win the competition of ALD AlOx process and get 1st PO of ASM solar cell VDF tool in Taiwan. ADVANCED SEMICONDUCTOR MATERIAL EUROPE – Taipei, Taiwan Sr. Process Specialist, Oct. 2010 ~ Feb 2012  VDF (vertical diffusion furnace) product process support and CIP management at DRAM customer sites (NTC / INOTERA).  Support at Yingli China and successfully get worldwide 1st PO of ASM VDF tool in solar cell industry.

 TCAD simulation and device layout for new TMBS (trench MOS barrier Schottky) products.  New product development, such as TMBS 45V, 60V, 80V, 100V, 120V and 200V.  New process development, such as Schottky barrier from 500~800eV (PVD sputtering/ diffusion sintering) and power device metal field plate develop (PVD evaporator).

 Responsible for Schottky product integration including wafer level and package.  Lead product yield improvement, reliability improvement and cost reduction projects.  Solve customer complain issue.  Co-develop with R&D department for Trench MOS barrier Shcottky (TMBS) platform development and successfully start worldwide 1st TMBS mass production in power semiconductor field.

 Responsible for diffusion / CVD / PVD / etching module.  Process sustaining such as SPC, trouble shooting, process improvement, new material / 2nd source evaluation and cost reduction.  Survey new tool with low CoO, high performance for relative module and qualify the process.  Support FAB expansion and transfer products from 4 inch to 6 inch such as planar Schottky and auto rectifier.