Piyas Chowdhury

FINITE ELEMENT ANALYSIS (FEA) with ANSYS and LS-DYNA - Evaluating thermo-mechanical risk at various stages of electronic product development- Wafer-level bond & assembly of microelectronics, 2.5D & 3D IC packaging, fully assembled data center hardware (rack-mounted servers & network switches) and consumer electronics (laptops, mini-PCs), - High force heat sink assembly, chip-package interaction, package-system interaction, LGA socket loading, BGA reliability, wafer/package/PCB warpage, memory/storage device latching mechanism, handling/assembly risk, transportation-induced shock/vibration risk - Root cause analysis of product issues reported at consumer end and providing actionable solution under time constraintMECHANICAL DESIGN, 3D CAD MODELING, & DRAWING (with SOLIDWORKS & CREO) - Full CAD modeling with dimensioning & tolerance loop analysis (GD&T, DFM) of large assemblies- Production-ready mechanical drawings of complex electronic enclosure parts & assembly & various thermal/mechanical test fixures & prototype buildup PRODUCT LIFE MANAGEMENT (PLM) - Maintaining production parts with PLM software (generating, organizing & updating bill of materials, CAD models & supplier spec documents in AGILE) TESTING - Custom-designed cost-saving in-house TIM evaluation jig with Chroma Cobra ATE system- RCA of mechanical issues related to high-power ASIC cooling systems (high-pressure heat pipe/vapor chamber heat sinks), LGA socket contact, TIM2 pressure uniformityMATERIAL SELECTION - IC packaging materials qualification (TIM, underfill, epoxy molding compounds) from multiple vendor specs - Lab testing (modulus, CTE, fracture/delamination) & analytical/numerical screening of materials with FEA simulation & MATLAB programsINDUSTRIAL & ACADEMIC R&D (UIUC & IBM) - Fine-tuning damage tolerance of electroformed coatings & carbon composites used in aerospace industry- Tailoring thermal and mechanical properties of polymeric TIMs- 20+ technical journal publications (1 best paper winner) and 2 US patentsPROFESSIONAL VOLUNTEER SERVICES - Organizing sessions & screening technical publications at ASME & IEEE conferences - Technical advisory support to graduate student research at Purdue University & Semiconductor Research Corporation (SRC)- Volunteer peer-reviewing of 100+ scientific papers for Elsevier, IEEE & numerous other international publishers