Nitin Ghodgaonkar

• Responsible for the engineering activities of Semiconductor Packaging & EMS Plants for manufacturing of Photo Detectors & X-Ray detectors in packaging plant and PCB Assembly & box build of RF, Power & digital systems in EMS plant for various market segments. • Major activities include TOT & New Product Introduction from R&D to Production for optimum capacity utilization with high yields and Test setup design & Fabrication • Mentor a team of 60+ engineering professionals for systematic problem-solving approaches. • Supervise R & D team for design of new products ensuring that DFX principles are followed as a part of development for products & processes. • Workout costing for products & services and work closely with Sales to win the business.

• Established Class 1000 IC packaging plant for design & manufacture of miniaturized components in QFN, BGA & HMC using MCM, SiP, CoB, LTCC and Hybrid Technologies. • Worked with Engineering and Manufacturing teams for successful product realization using packaging techniques like Stacked Die, Flip-Chip, Fine Pitch Wire bonding, PiP, PoP, Special Materials etc. in 2/2.5/3D System-in-Package (SiP) configurations. • Design & Development of New products: Digital, Analog, RF, Power and MEMS systems for Space, Aerospace, Military, Automotive, Medical & Consumer. • Worked with NPI team to define process flow, DOEs, process control & reliability test plans to ensure effective & efficient project execution for high production yields & timely deliveries of high-complexity products. • Interacted with customers to understand their requirements and provide optimum technical solution. Coordinate with marketing team for product costing & order closure.

• Electronic Product Design : RFID Access control, Car infotainment system etc. • Industrial Product Design : Hand held computer, Thermal printer, Emergency Phone etc • FEA, CFD Projects : Gas Turbine, CRDi engine, Shop Floor ventilation etc.

• Packaging of ASIC’s in Ceramic & Plastic packages. • Assembly of Thin Film Hybrid microwave components. • Re-engineered & localized imported 11 GC Microwave circuits. • Set up the process for assembly of SAW Devices.

• Production Planning and control for manufacturing of Thick Film Hybrid circuits • Communication hybrids, Resistor & RC networks for local & export markets

• Production Planning and coordination for manufacturing & testing of Optical Sensors • Process optimized for high production yields • LED array scanner, Pulse Oxy-meter probe and other optical sensors

• Team Member in R&D projects • Designed & fabricated of LPE reactor for the manufacture of LED's & LASER diodes. • LASER transmitter module & preamplifier was re-engineered & localized. • New Thin Film Hybrid microwave components introduced