Nan Liu

Research and prototype innovative electron optics systems under the office of CTO, for future electron beam applications in industry like semiconductor metrology. •Electron sources physics review and characterization systems setup •Electron optical system review, design, evaluation, risk retiring and setup •UHV system setup, high voltage electrical control module & mechanical components design

• Specialize in the X-Ray Microscopy technology and promote its applications in both industry R&D and academia researches. Evaluate applications and support solution/configuration customization for various customers in APAC region. • Understand customer’s research, demonstrate Zeiss X-Ray Microscopy applications in various fields. Intensive experience and knowledge development handling applications in materials science (metals, composites, battery, ceramics, etc.) and electronics. • Work closely in team with product center, sector and sales team to visit customer sites, present in workshops, attend conference, interact with KOLs to learn about recent market trends for business development. • Internal training and deployment of sector marketing materials, sales strategy, competition analysis to local sales organization. • Create and promote Zeiss correlative microscopy workflow, especially X-Ray Microscopy with SEM and FIB, to innovate advanced imaging solutions to address emerging R&D challenges.

• In charge of an international customer 65nm/90nm eFlash products for stable production. Successful wafer out ~1k wafers per month. Report to customer regularly and drive yield improvement in teamwork. • Understand FAB manufacturing process flow. Work in collaboration with different area module engineers for stable FAB process maintenance, BKM study on different fab process for yield improvement. • Drive yield improvement in teamwork. Work with module and QA engineers for FAB process maintenance, low yield root cause verification, yield improvement, engineering action plan and execution. Collaborate with FA team for eFA/FIB/TEM defect and failure study • Maintain SPC control of product final etest and yield, analyze correlation with process inline parameter/tool abnormality for improvement. • Knowledge and experience in DOE experiment for defect and yield improvement. Experience in product tape out process, JDV mask and DRC rule check, handbook setup.

• Professionally trained in charged particle optics both theory and practice. In depth understanding and hands-on experiences in electron/ion beam systems operation and imaging optimization (SEM, FIB and MeV ion accelerator). • Developed and fabricated a novel lab-on-chip gas ion source for ion lithography application. Designed and set up ion source characterization experiments inside a SEM chamber, achieved 100 times higher brightness than existing radio-frequency (RF) ion source. • In depth knowledge in vacuum technology, and experiences in set up high vacuum test system with positioning stage control, gas and high voltage electrical feed-through for ion source test. • Knowledge of electrical breakdown in matters & electrical insulation, laboratory high voltage testing techniques, circuit interruption and breakers. Familiar with charged particle beam high voltage electric systems, and their roles in affecting optical system performance. • Good experience of using charged particle optics simulations software for ion source/column design and characterization. Co-designed a compact 200 keV ion lithography system to achieve sub-10 nm resolution. • Experienced in customizing vacuum chamber system and port designing. Set up a SEM system by integrating an electrostatic electron column, customized vacuum chamber and pump system. • Good physics knowledge and experience in semiconductor technology, e.g., UV lithography, plasma operation and other clean room processes for lab-on-chip device fabrication.

PhD thesis: Development of an electron impact gas ion source for proton beam writing applications