梃嘉翁

Principal Product Engineer @ TSMC

About

Personality: Fast learner, strong analytical skill and sharp minded in decision making, with solid interpersonal & communication skills, motivated speaker in meeting and presentation. Process Relative: Experienced in N7~N2 IC manufacturing processes and familiar with semiconductor device physics. Specialized in yield ramping, parametric analysis, device boost and process developing with factory, able to balance the dilemma with production and quality. Certificate: IELTS Academic 6.5 (2023.10) Special Experience: Working Holiday in Brisbane, Australia during 2019.10~2020.03.

Country

Taiwan

City

Hsinchu City

Industry

Semiconductors

Skill

簡報技巧, 團隊領導, 分析技巧, Communication, Process Engineering, Data Analysis, Microsoft Office, PowerPoint, English, Chinese, Engineering, Yield Enhancement

Experience

Principal Product Engineer

TSMC

2020-4 - Present · 6 yrs 6 mos

台灣 Taiwan 新竹市

1. 2nm parametric team leader responsible for product performance boost, critical path finding, cross-team collaboration, customer handling, and customer/internal meeting presentation 2. 3nm plus yield team leader responsible for yield bring up, cummunicate with customer and co-work with fab to solve major failure mode for increasing the yield. 3. 3nm test vehicle/product performance improvement by analyzing WAT/device under novel process knob and co-work with Fab to figure out new opportunity. 4. 3nm APCM data querying system and analysis methodology establishing. Co-work with layout design team to add PFA hotspot into NTO. 5. 5nm/5nm plus customer product EFA bitmap/SONE automatically organize data system establishing and analyzing. Co-work with PFA/SRAM team for failure mode clarifying.

Product Engineer

TSMC

2018-4 - 2019-7 · 1 yr 4 mos

新竹市

1. 7nm plus customer mobile/HPC product yield improvement experiment before mass production. 2. Chip performance improvement, perform troubleshooting and yield-improving by analyzing datalog, CP, WAT, inline data, and layout with Fab. 3. Cooperate with test team to solve testing issue and define spec to convince customer.

Intern

United Microelectronics Corporation (UMC)

2015-7 - 2015-8 · 2 mos

1. 28nm process flow studying. 2. SPC analysis and daily yield update

Education

National Cheng Kung University

微電子所

2015 - 2017 · 2 yrs

1. Studying in the domain of 3DIC TSV and MEMs gas sensor. 2. Publishing 'Novel top-down Cu filling of through silicon via (TSV) in 3-D integration' at the IITC international symposium. 3. Publishing 'A Bifacial SnO Thin-Film Ethanol Gas Sensor' on IEEE Electron Device Letters.