웅표 이

I'm working at Amkor Technology Korea with 15 years of semiconductor packaging assembly and test house as process engineer and process development in RND. I have experience for variety processes specialized in for Package on package process /LAB/ TCB/ electrical testing. During the master's degree, I extended my engineering knowledge and used them to actual process to build package on package. I contributed in process improvements for package on package process by using result of DOE. I performed activities of quality improvement through analyzing the root cause of defect, process optimization and material localization for cost reduction and yield improvement. I had experience of sharing opinions with related departments to resolve problems, and I has been valuing teamwork to solve problems. I always struggle to do professional engineer and my understanding of variety processes and experience will help innovation and connection between various technologies - Perform product analysis and suggest process/improvement item - Play a window role between supplier and product team - DOE and data analysis for process optimization - Interface with the product/engineer and business unit to drive activities - Relationship between multiple manufacturing sites and engineering - Cost reduction & Risk management - Monitoring target for KPIs - Ability to adapt to changes in the work environment or unexpected events.