Chih-Hao Tseng

[Study Experience] ･ Bachelor degree (2012-2016) Cheng-Kung University - Material & Science Engineering Basic science of materials/electronics/semi-conductor ･ Master degree (2016-2018) Cheng-Kung University - Material & Science Engineering Professor: Chien-Ping Ju Research Topic: Structure and properties of laser-surface-modified carbon-coated stainless steel PEMFC electrode chemical & electrical properties enhancement through surface treatment ･ On-the-job training (2022-2023) National Tsing-Hua University - TCFST National Chiao-Tung University - LLSRC - FPGA digital IC design (VHDL/Verilog) - Synopsys TCAD Sentaurus device simulation - HSPICE (Digital electronics simulation & verification) - Semiconductor Memory Device, Technology and Applications - Vehicle IC HV Devices technologies (ESD/LU/Reliability) - EMC debug & diagnostic [Working Experience] ･ Innolux Corporation (2020-2021) "New Material Research & Development Engineer" New P.R. material testing and Validation IPS Test cell development for EIS fitting ･ Micron Technology (2021-2024) "Advanced Development Technology Process Integration Engineer" - 1α tech-node (140s) MOL1 (CMOS Gate) owner DDR5 product HVM to MY cross-loop process improvement - 1β tech-node (150s) MOL1 (CMOS Gate) co-owner Co-own DDR5/HBM3e product pi-run to HVM stage - 1γ tech-node (160s) MOL0 (CMOS Gate) Transfer core team LPDDR5/GDDR7 initial product input & transfer pi-run to SVC stage schedule management & device trouble shooting Mask design & tape-out for real-Si structure & WAT properties modification Lead for device properties improvement (Z-score/GIDL/DIBL/SVTM/IDVG/Leff) Also response for ISPEC/ESPEC Cpk & process margin improvement