哲君 劉

1. Familiar with 2.5D, 3D &FOPLP knowledge & process. (fan-out wafer&panel level package) 2. Support advance package of PTI top2 AI customer. (Over 4 NPI project) 3. Support the tier 1 ASIC customer (B-company) to develop AI accelerator chip. (over 10 chips on package with 2.5D, 3D fan out process) 4. Support the tier 2 GPU customer (A-company) to develop GPU product with FOPLP. 5. Define micro bump design for in line measurement on process. 6. Improve non-jointed issue between ubump and ubump on LAR process. (improve yield over 80%) 7. Provide customer 2.5D, 3D and panel package BOM, material, design recommendation and technical support & service. 8. New device qualification and production release. 9. Define and set up the process flow, control plan, FMEA and the yield improvement required for NPI. Integrate factory resource and customer requirement to resolve all engineering or technical issue & problem and CIP.

1. Familiar with WLCSP knowledge & process. (Bump & DPS) 2. Leading product team about 8 engineer. 3. Success support Amkor top3 customer NPI to HVM over 30 product . 4. Development tire 3 AI IC customer IPDs product from NPI to HVM. 5. Improvement yield on DBG IPDs product from 99% to 99.8%. 6. Create BKM parameter for WoW product with WLCSP. 7. Success leading pico laser process on WLCSP.

1. Support Amkor DPS top3 customer. (output increase to > 1500pcs/month) Support the tier 1 mixed signal IC customer (C-company) to imporve yield from 99.90% to 99.95% (WLCSP). 2. Support the tier 3 RF IC customer (N-company) to qual new key process machine. 3. New lamination material validation with tier 3 IC customer (S-company) to support cost saving & short wave IR inspection. 4. Improve new DPS process and success to implement current customer. (cycle time decrease about 8% & decrease manual handle risk) Provide customer assembly BOM, material, design recommendation and technical support & service. New device qualification and production release. 5. Define and set up the process flow, control plan, FMEA and the yield improvement required for NPI. Integrate factory resource and customer requirement to resolve all engineering or technical issue & problem and CIP. 6. Leading and support end customer audit & NPIs per ramp audit.

1. As the PM to integrate the factory to get customer requirement. 2. Support customer any technical promble, CIP and DOE. 3. Success qualification SOP, QFP, QFN leadfram to A-company. (Grow to Top2 cusotmer before leaving) 4. Support the top 1 assemble customer (A-company) to start micro-etching process. (quailfication MSL1 for QFNs and automotive market) 5. Develop new rough Ag process to enhance the adhesion capablity of Cu wire & Ag surface of leadfram lead. (To prevent delame issue on reliability)

1. Support cross-section sample fabrication and SEM & EDS analysis. 2. Support FTIR sample fabrication and analysis. 3. Support wire bond, solder ball and reliability test.