贾伟杰 贾

贾伟杰

研发工程师(先进封装,tape out,PDK,工艺整合) @ Hisilicon

Country

-

City

China

Industry

Semiconductors

Skill

srfv, 工艺整合, DRC, 设计规则, tape out, lake,calibre等EDA软件

Experience

Hisilicon

工程师

Hisilicon

LinkedIn
2021-11 - Present · 4 yrs 11 mos

中国 北京市

Frame design & FSA coding &PDK

SMIC

研发工程师

SMIC

LinkedIn
2018-9 - 2021-11 · 3 yrs 3 mos

中国 北京市

1. tape out相关,design rule,tsk & frame design layout,PV code,JDV 2. 工艺开发和电性测试

Education

Jiangsu University

Jiangsu University

LinkedIn

机械工程

2011 - 2018 · 7 yrs

贾伟杰 's Contact Information

Email

******@***.com

Phone

(**) *** ****

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