yun hsieh

yun hsieh

equipment engineer

About

In order to enhance my knowledge, I chose to enter the Institute of Precision Engineering in National Chung Hsing University. And I further specialize in the field of semiconductor and MEMS. My research thesis is “The study of internal friction and energy loss in nanocrystalline Cu thin film”. Studying in internal friction in different thickness of copper thin film by using the resonant and free decay method. I was rewarded as the third place in 2012 Semiconductor Thematic Contest. In 2013, I represented our laboratory to participate in 2013 MRS Fall Meeting & Exhibit in Boston. This is a rare opportunity to step out of our own country. So I worked very hard for this opportunity. During the training in the institute, I learned the process of machine operation, specimen process improvement, and specimen measurement experiment. Also I used the software like AutoCad, Solidwork, Pro-E program. I gained the ability to solve problems. I believe these skills and experience will be helpful for the work. With my expertise, experience, and positive attitude, I am ready for this job. Thank you.

Country

taiwan

City

taipei city

Industry

semiconductors

Skill

process improvement, autocad, ptc pro/engineer, mems, semiconductors, mechanical engineering, equipment repair, 制造业, spc, 故障分析, 半导体, 工艺过程, 故障类型与理象分析, 半导体行业

Experience

tsmc

equipment engineer

tsmc

2015-10 - Present · 11 yrs

* Handle Diffusion, Thin Film, Lithography or Etching equipments. * Warm up and trouble solve with high tech equipments. * Improve and enhance the efficiency of equipments * Plan and execute the analysis or defect detection projects. * Communicate with cross function engineers or venders

Education

national chung hsing university

national chung hsing university

2012-1 - 2014-1 · 2 yrs 1 mo

Further specialize in the field of semiconductor and MEMS. Research thesis is “The study of internal friction and energy loss in nanocrystalline Cu thin film”. Studying in internal friction in different thickness of copper thin film by using the resonant and free decay method. Rewarded as the third place in 2012 Semiconductor Thematic Contest. Represented our laboratory to participate in 2013 MRS Fall Meeting & Exhibit in Boston.

tamkang university

tamkang university

mechanical engineering

2008-1 - 2012-1 · 4 yrs 1 mo

yun hsieh's Contact Information

Email

******@***.com

Phone

(**) *** ****

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