Yuelin Wu
Foundry Process Integration Engineer: 14nm FinFET Technology @ Samsung Semiconductor
About
I am a Process Integration and Yield Engineer with over 6 years of experience driving New Product Introduction (NPI), yield maturity, and data automation across leading-edge semiconductor technologies. My expertise spans 14nm FinFET logic, 2.5D/3D advanced packaging, Floating-Gate 3D NAND, and wide-bandgap (diamond) power electronics.
United States
Austin
Electrical & Electronic Manufacturing
Failure Mode and Effects Analysis (FMEA), Semiconductor Fabrication, Python (Programming Language), JMP, Design of Experiments (DOE), Data Analysis, Technology Development, NAND Flash, Mass Production, Quality Management, Product Development, Test Time Reduction, Process Integration, Advanced Packaging, Defect Reduction , NPI Management, Yield Enhancement, Statistical Process Control (SPC), Semiconductor Process Technology
Experience
Foundry Process Integration Engineer: 14nm FinFET Technology
Samsung Semiconductor
Austin, TX
Own 14nm FinFET products from NPI to mass production
Yield and Process Integration Engineer: 3D-IC Packaging
Intel
Hillsboro, OR
Transferred and ramped Intel 2.5D/3D advanced packaging technologies as the integration owner
Product Development Engineer: NAND Sort Test Development
Intel
Folsom, CA
Led wafer sort test mode validation and test time reduction for Intel 3D NAND technology production ramp
Yield and Process Integration Engineer: NAND Process Development
Intel
Dalian
Led cross-functional teams to enable effective probe screens and guide fab process DOEs for yield improvement in early technology development phase
Postdoctoral Research Associate: Ultrawide-Bandgap Semiconductor Device
Michigan State University
East Lansing, MI
Designed/fabricated diamond-based power electronic device
Education
Michigan State University
Chemical Engineering
Tianjin University
Chemical Engineering
Yuelin Wu's Contact Information
Phone
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