Yu Xiang Wang

Sr. Hardware Engineer @ Wistron

About

Senior Hardware Engineer with over 8 years of experience in high-level system architecture, electronic circuit design, and board-level verification. I specialize in Data Center Switches (800G/400G), and Consumer Networking (Wi-Fi 6/Mesh). I take pride in technical execution—from defining architecture and selecting components to hands-on board bring-up and debugging. I thrive in cross-functional environments, collaborating effectively with mechanical, thermal, and software teams to deliver high-quality products. Core Competencies: High-Speed Design: up to 112G SerDes, Signal Integrity, System Architecture, and Power/Clock tree design. System Integration: Liquid cooling leak detection, CPU/BMC/FPGA/CPLD control logic, and system protection. Validation: Comprehensive board bring-up, power analysis, and solving critical EMI/Thermal issues.

Country

Taiwan

City

Hsinchu City

Industry

Electrical & Electronic Manufacturing

Skill

Oscilloscope, Network Analyzer, Signal Analyzer, Microsoft Office, Python, Allegro, OrCAD Capture CIS, Oracle BOM, PADS

Experience

Sr. Hardware Engineer

Wistron

2021-2 - Present · 5 yrs 8 mos

Hsinchu City, Taiwan, Taiwan

Responsibilities: Participated in system architecture evaluation and design to ensure feasible implementation. Collaborated closely with cross-functional teams to ensure effective communication during hardware–software integration. Selected key components based on performance, reliability, and BOM cost optimization. Reviewed PCB layout constraints and verified that designs met electrical, thermal, and manufacturing requirements. Defined hardware specifications and test plans to support development and validation activities. Performed system-level functionality testing and debugging to ensure design integrity and stable operation. Conducted second-source component verification to enhance supply chain flexibility and reduce sourcing risks.

Hardware Engineer

Shenzhen Gongjin Electronics CO.,LTD

2017-2 - 2020-12 · 3 yrs 11 mos

Zhubei City, Taiwan, Taiwan

Responsibilities: Executed baseband and RF circuit design, evaluation, and debugging for wireless communication products. Designed power supply circuits and conducted power consumption analysis to optimize energy efficiency. Reviewed and applied PCB layout constraints to ensure signal integrity and manufacturability. Performed system functionality testing and supported board-level troubleshooting. Conducted precision PCBA rework (including 0201, BGA, QFN) to support rapid prototyping. Executed second-source component verification to ensure supply chain flexibility. Supported New Product Introduction (NPI), successfully transitioning two products into mass production.