yu gu

* Wafer handling. * Deboxing and wafer inspection. * Defect documentation and feature measurement * Copper plater manipulation and adjustment * FTIR wafer analysis * Laser marking

Summer internship at FlipChip International LLC, as a process engineer. Trained in both FABRICATION and RELIABILITY LAB. - Trained in operations applied to bumping, copper pillar bumping, and wafer level chip scale packaging (WLCSP) manufacturing processes, including thin film lamination, wafer grind, photo lithography, photoresist coating, copper plating, metal sputtering, metal etch, plasma dry etch, solder printing, laser marking, quality inspection (AOI), dicing, and traditional wire bonding. - Learned failure analysis skills in sample cutting, organic solvent potting, sectioning, and polishing. - Trained with optical microscopes, scanning electron microscopes (SEM), X-ray microscopes, shear tester, and drop tester. - Took part in troubleshooting activities with process engineers for different process issues, including thin-film lifting, micro voiding at layer interfaces after high temperature storage (HTS), and dry film residual after chemical etch.

* Summer internship at TSHT China, as a technical support engineer. * Trained with the theories and applications used in the traditional IC packaging industry. * Gained operating experience with dicing saws, wire-bonding, die-bonding, laser stamping, and hydraulic presses. * Solved one particular production issue caused by a mistranslation of the user manual of a wire-bonder, ASM model Eagle 60.

* Summer internship at SIEMENS China, as a quality engineer * Trained on tools used in manufacturing of Printed Circuit Board (PCB), including wave-soldering machines, chip mounters, and circuit testers. * Coded a Matlab program used to monitor the production and remaining amount of particular electronic components.

* Teaching assistant for graduate level course * MAE 270A (Linear dynamic systems), in mechanical and aerospace engineering department, at UCLA * Give supplementary lectures about the course materials * Hold office hours to help and instruct students digest the course work * Invigilate exams * Grade Assignments and exams

Majored in Mechanical Engineer at MAE department of UCLA. With solid background knowledge with following fields: Dynamics, fluid mechanics, numerical method, CAD, manufacturing, programming, heat transfer, thermodynamics, control theory, mechanisms, material science, physics, chemistry. Activities and Societies: - UCLA Mechanical Engineering Annual Robot Competition 4th Place Winner. - UCLA Martial Art Association Member. - UCLA Thank UCLA - Student Giving Committee Member and Volenteer - UCLA Peer Learning Center - Calculus Tutor

Mechanical Engineering major, specializing in System and Control field. Familiar with liner/nonlinear control theory, optimal control, stochastic control, real-time filtering, etc. Industrially specializing in IC packaging field, especially in flip chip bumping division. Experienced in WLSCP, Copper pillar bumping, Copper RDL. Activities and Societies: Martial art club - boxing sector