YoungDuck Yoon
Parts Manager @ Amkor Technology, Inc.
About
Broad knowledge and experience in advanced package stabilization & development for more than 20 years including 2.5D COWOS, various Flip Chip BGA(Bare die, 1 piece lid, 2piece lid, MCM, chiplet, coreless substrate, metal TIM and IPD) supporting AP, Datacenter CPU, GPU, AI, image processor etc. High level working experience & coordination skill with multi functional technical package teams including nVidia, Ampere, Microsoft, Amazon, TSMC, Intel, TI, Altera, Toshiba, Panasonic, Sony, Infineon, Broadcomm and Qualcomm to develop & qualify robust high-end Flip Chip BGA packages and hybrid Flip Chip.
South Korea
Gwangju Metropolitan Area
Semiconductors
-
Experience
Parts Manager
Amkor Technology, Inc.
Songdo, Korea
Process/Product Engineer for TSOP(4years), Camera Module(3years), Flip Chip BGA/(15years)
Education
Jeonbuk National University
화학공학
YoungDuck Yoon's Contact Information
Phone
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