Young Guen Song

- Responsible for advanced package test engi eering

- Enabled and launched new DDR5 technology for Intel cilent & server platforms - Launched Intel client platforms with LPDDR5/5X memories - Characterized and validated DDR5 and LPDDR5 components and modules with Intel platform features - Analyzed HBM failures and drove the memory suppliers to do the corrective action - Built the system memory validation team in Korea and hired the talented engineers

100+ people management proven leadership and led critical & large scale of projects with strategic thinking and risk taking Led new DRAM technology & engineering development for HBM2E market penetration to take the number ONE supplier position - Achieved 98% of market share of 1 Billion available market - Successful product launch by taking the roles for new DRAM technology development, qualification and manufacturing within tighten time period System level memory module production test methodologies innovation - Quality improvement with special enhanced dedicated segment test - productivity improvement up to ~68% test time and COT(Cost Of Test) - Optimized manufacturing HDM(High Density Module) test flow - New algorithm development for productivity and screen ability improvement Established 3DS package test strategy together SOC and memory Awarded SKMS by taking #1 supplier position of HBM2E and system level memory test methodology innovation for HDM(High Density Module)

- Mobile and commodity memory enabling for mobility/client and server platforms - Supplier management, ATE & system level test and validation, project management, memory roadmap alignment, cost analysis, FA/debug etc - Low power DRAM, high speed DRAM, DFx, AC/DC characterization, thermal temp sensor, package, DUT board, socket etc - Expertise in memory controller and DRAM training - Establish ATE & system validation strategy and enabling for new DRAM and DIMM technologies(high speed, low power and TSV) - Enabled new DRAM technologies; DDR5, LPDDR5, HBM2E, GDDR6 and DC Optain - Defined HBM spec addendum

Expertise - High speed digital(SerDes and MGT-Multi-Gigabit-Tranceiver) beyond 10Gbps serial interface - High speed memory DDR3 and GDDR3/4/5, Rambus DRAM and Rambus XDR DRAM beyond 6.4 Gbps - Mixed signal and RF - Semiconductor test methodology and test program development for characterization and production - Test solution strategy for COT(Cost Of Test), design characterization and manufacturing - High speed DUT board design and socket development - Project management, business development, and global account management

- DRAM architecture, design, test and characterization