yong cheng

* Led and coached a team of engineers to perform failure analysis of PCBA from yield, product assurance, customer qualification testing and customer returns. * Provided product engineering support of new products launching and release products. * Performed in-depth failure analysis for the product as well as PCBA performance analysis and risk assessment study prior to product launch. * Worked with suppliers, regional team and cross functional team on product sustaining and engineering. * Focal contact with US and local design centre on PCBA design, application and quality issue. * Put in place preventive measures and resolve component related failures with vendors till corrective actions were implemented.

* Source, identified and developed potential vendors. Maintained the integrity of the Approved Vendor List by carrying out evaluation when qualifying alternate source for cost reduction and yield improvement. * Facilitated the utilisation of existing/emerging component technologies in new Adaptec design. * Established and implemented tests to meet product and component reliability expectations. Reduced the cost of quality by preventing or correcting all commercial component problems. * Provided prompt and excellent technical support to design, manufacturing, purchasing and quality personnel.

* Responsible for the failure analysis of Adaptec’s SCSI, RAID, Network Interface and Fibre Channel cards on line, reliability test, finished goods audit and RMA customer return failures. * Resolved component related failures with vendors or US counterparts till corrective actions were implemented. * Directed evaluation project on BGA to determine the possible root cause of de-lamination induced during manufacturing and rework processes. Reduced the occurrence of thermal over-stress on BGA. * Set up new failure analysis capabilities to analyse/verify component failures. * Provided statistical data analysis on board failures at in-circuit and functional test station, focusing mainly on top component rejects. Assisted Supplier Quality Engineering in driving component quality issues with suppliers; worked closely with Test Engineering in reducing false rejects of key components at board tests.

* Responsible for the printed circuit board design and development of high performance, multilayer USB, FireWire (1394), SCSI, audio video and media server products, working towards on-time delivery, quality and profitability in each project. * Actively participated in the research and design of advanced development projects, taking them through from concept development phase to product launch in market. * Developed and implemented improvements to working practices and design rules, conforming to internal Design for Manufacturing (DFM) and Design for Test (DFT). * Worked closely with vendors to track PCB technology and costs trends. Evaluated and introduced new vendors for quick turn prototype PCB fabrication. Achieved quick PCB fabrication turn around time and cost savings. * Performed the task of system administration, design tools maintenance and upgrade. Wrote scripts to improve efficiency and effectively cut down time on tedious and time consuming process. * Performed librarian functions by creating and maintaining the symbols and footprints in the libraries.