Yanmei Song
Principal Engineer @ Qualcomm
United States
San Diego
Semiconductors
Composites, Design of Experiments, Polymers, JMP, Rheology, Matlab, Characterization, Surface, Six Sigma, Thin Films, Scanning Electron Microscopy, Materials Science, Semiconductors, AFM, Failure Analysis, Simulations
Experience
Principal Engineer
Qualcomm
Greater San Diego Area
- 2.5D and 3D advanced package technology development for high density D2D. - Fan out RDL interposer and heterogeneous chiplet integration. - Wafer level and panel level packaging process baseline and yield improvement. - Large FCBGA and MCM for high performance computing.
Failure Analysis Engineer
Intel
Chandler, Arizona Area
Process TD Engineer
Intel
Chandler, Arizona Area
Education
Arizona State University
Chemical Engineering
GPA: 4.0+/4.0. Outstanding Research Assistant Award The Society of Rheology Travel Award GPSA Travel Award
Tianjin University
Chemical Engineering
Outstanding Master’s Thesis Award
Yanmei Song's Contact Information
Phone
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