Xin Li

Selected as a student ambassador under SSIA’s Semiconductor Active Youth programme. Participate in industry forums, company visits, and ecosystem events across foundry, IDM, OSAT and design sectors, gaining exposure to manufacturing, advanced packaging, and silicon photonics trends. Contribute to strengthening engagement between students and industry stakeholders.

My research focuses on co-packaged optics (CPO) and optical redistribution layer (ORDL) integration, exploring optical interconnect solutions to support next-generation high-bandwidth chip packaging. My work primarily involves: 1. Designing and optimizing process-compatible optical coupler structures to enable efficient coupling between silicon waveguides, polymer waveguides, and optical fibers (e.g., inverse-taper-based edge coupler designs). 2. Investigating key engineering challenges in optical coupling for advanced packaging, including propagation loss, mode mismatch, polarization dependence, and alignment tolerance. 3. Performing electromagnetic simulations using Ansys Lumerical FDTD and Eigenmode Expansion (EME) to evaluate mode evolution, coupling efficiency, and optical transmission characteristics. 4. Exploring design optimization strategies compatible with existing fabrication processes, supporting scalable optical interconnect integration for advanced packaging platforms. This work contributes to improving optical interconnect efficiency and integration feasibility for emerging co-packaged optics architectures. Tools: Ansys Lumerical FDTD / EME

As an Internal & External Events Executive at the NUS Semiconductor Club, I help build student engagement in semiconductors through on-campus events and industry engagement, including talks, networking sessions, company visits, and collaborations. My role bridges students, academia, and the wider semiconductor ecosystem in Singapore.