Xiaoxing Lu

Microfabrica merged with Technoprobe America Inc.

Report to Sr. VP of R&D • Lead complex and high-visibility internal and customer-driven R&D projects to enable new applications and capabilities. • Work with stakeholders to understand and develop clear goals for individual technical projects. • Organize cross-functional teams to fulfill required functional expertise and work with departments across the organization to manage resources. • Develop and monitor project schedules. • Engage and manage external suppliers and engineering teams. • Assess project risks and oversee the implementation of mitigation strategies. • Provide routine and strategic updates to stakeholders that are clear and concise and enable them to make critical decisions. • And other duties as assigned.

#Production management - Set up process strategy and route for product and process development and monitor the Work in Process (WIP) to make sure that production stays on schedule to meet delivery dates. - Manages material, equipment, staff, facilities, and processes required to meet the production goals and shipping schedule. - Ensure raw material inventory is sufficient to support production demands. - Control and monitor Department KPI, Process Control Charts, and NC (Non-Conforming Report). -Identify ways to make the production process more efficient and reduce production costs. - Direct facilities maintenance personnel and activities and implement better training programs. - Keep abreast of new technology that can be used in the production process. - Review manufacturing specifications and SOP, and create new documents required. - Cooperate with Quality Assurance in handling CAR and/or PAR (Corrective Action and Preventative Action), customer returns, customer complaints, and supplier issues. #Yield Improvement - Support and drive device yield and process parametric improvement work on Integra products. - Identify and implement root cause solutions to yield loss mechanisms through statistical data analysis and failure analysis techniques. - Evaluate and monitor product tests and process parametric data trends to identify issues requiring further investigation/resolution. Evaluate and disposition discrepant product held for yield enhancement engineering review. - Lead continuous improvement projects on products and processes for improved yield, cost, and quality by teaming with the product, test, design, and process engineering groups. #R&D for processes and product improvements. #EHS and ISO 9001 Internal Quality Auditing

#Project Lead GaN HEMTs cooperating with cross-functional internal and external teams. - Establish new GaN product and process module development plans and for RF power applications with cross-functional internal and external teams. - Lead process development, define and execute GaN technology in both in-house Wafer Fab and outsourcing foundries. #Project Lead of Fab tools and systems upgrade and renovation with cross-functional teams. - Created Capital Expenditure Proposals to justify project and improvement purchases. - Purchased new equipment and upgrade/modified hardware for Wafer Fab and DiePrep. - Install and qualify manufacturing capacity. - Document SOP/instruction, train operators/engineers. #Review, maintain, develop, and improve tools and wafer fabrication processes for RF power applications, cooperating with designing and application teams. - SPC: characterize materials and wafers to ensure their quality, uniformity, performance, and yield for use in integrated devices and pallets that must meet specialized design and performance specifications. - FMEA: correlate the performance to wafer processes, analyze product failure data and laboratory test results to determine root causes of problems, develop and evaluate solutions. - Identify processes and parameters improvement needs; drive the improvement plans. - Lead new products and processes development per internal and external request. #R&D for processes and product improvements. - Define and monitor key performance parameters and yield, qualify new processes/process change, and troubleshoot process failures with outsourcing foundries aligning with the internal R&D team, engineering design team, and marketing team according to business needs. - Act as linking pin between in-house Wafer Fab, outsourcing foundries, Die Prep, R&D team, engineering design, product production, and QA to secure a smooth inter-department communication and solid ramp-up.

Plasma-assisted Molecular Beam Epitaxy (PAMBE) Growth of Metal-polar Lattice-matched In0.17Al0.83N/GaN heterostructure • InAlN/GaN MBE Growth and Device:  Growed InAlN/GaN heterostructure films by plasma-assisted molecular beam epitaxy (PAMBE)  Investigated Indium incorporation as a function of impinging In/Al flux ratio and growth temperature  Optimized MBE growth of lattice-matched In0.17Al0.83N/GaN to control composition modulation  Characterized film thickness, chemical composition and quality via HR-XRD, TEM, EDX and AFM  Designed capacitor, Schottky diode, Hall pattern, HEMT using L-Edit  Fabricated device and characterizing performance using Hall Effect System, Four Probe Station and Semiconductor Parameter Analyzer  Maintained a Molecular Beam Epitaxy (MBE) system and settedup charaterization tools (Hall, PLM, DLTS) • Electrical Characterization and Reliability Analysis of Al2O3/AlGaN/GaN MIS-HEMTs Structure  Deposited dielectric layer (Al2O3, SiNx) by PECVD, LPCVD and ALD for GaN-based MIS-HEMTs  Calculated fixed charge density, fast traps and slow traps density by Hall, single-frequency C-V, multi-frequency C-V and C-V hysteresis measurement.  Investigated gate current transport by I-V measurement from room temperature to 200°C.  Studyed dielectric lifetime and reliability using constant-current stress test and time dependent dielectric breakdown (TDDB) test on Al2O3/AlGaN/GaN MISH capacitors • Device Fabrication and Characterization  Fabricated various devices：MOSCAP, MOSFETs, BJT  Calculated oxide thickness of MOSCAP by LF and HF C-V measurement and calibrated with ellipsometer measurement.  Measured contact resistance of both n+ ploy and n+ S/D.  Calculated threshold voltage, transconductance, serious resistance, mobility, intrinsic gain and cut-off frequency  Investigated short channel effect and channel narrowing effect  Simulated processing and device performance by Sentaurus, and calibrated with experiment measurement

• PRODUCT REVISION: This includes revisions made to any current product for the following purpose(s): • Improved function for the customer • Improving the ease of manufacturing • Reducing the cost of manufacturing • NEW PRODUCT DESIGN: This includes the design of new features for existing products as well as design on entirely new products. • MANUFACTURING SUPPORT: It is the responsibility to follow their products through the manufacturing process. During this time the engineer is the provide the production department with any additional information required. • PRODUCT SUPPORT: Provide customers with information regarding a specific trailer in order to solve problems that may occur. • SALES SUPPORT: Provide information as requested by our sales staff.

• Evaluating carbon nanotubes mechanical behavior by finite element simulation • Designing Ge Zone Refining System

• Evaluating carbon nanotubes mechanical behavior by finite element simulation • Designing Ge Zone Refining System

• Involved in Planning, Maintenance, Troubleshooting, and Machinery failure and efficiency improvement activities of equipments. • Preparation and implementation of equipments with Maximo for PM schedules, failure analysis reports, history reports etc and keep records on CMMS system. • To plan, work and co-ordinate with projects department on equipments modifications and efficiency improvement activities, and arrange, co-ordinate meetings with other departments. • Prepare weekly, monthly reports regarding man hours utilization, resources, pending jobs, pm jobs, Equipment's Availability and Reliability and work orders statistics etc. • Mechanical service: roll grinding, crane service, vibration analysis, oil analysis, balancing, alignment

Diamond active electroplating and mechanical properties evaluation

Manufacturing process for transmission gear box of John Deere Tractor.

Plasma-assisted Molecular Beam Epitaxy (PAMBE) Growth of Metal-polar Lattice-matched In0.17Al0.83N/GaN heterostructure and Devices:  Growed InAlN/GaN heterostructure films by plasma-assisted molecular beam epitaxy (PAMBE)  Investigated Indium incorporation as a function of impinging In/Al flux ratio and growth temperature  Optimized MBE growth of lattice-matched In0.17Al0.83N/GaN to control composition modulation  Characterized film thickness, chemical composition and quality via HR-XRD, TEM, EDX and AFM  Designed capacitor, Schottky diode, Hall pattern, HEMT using L-Edit  Fabricated device and characterizing performance using Hall Effect System, Four Probe Station and Semiconductor Parameter Analyzer  Maintained a Molecular Beam Epitaxy (MBE) system and settedup charaterization tools (Hall, PLM, DLTS)

Wide bandgap materials (GaN-based III-V) and devices

- Strategic Management in a Globalized Economy - Managing Information Systems & Technology - Managerial Economics - Organizational Leadership - Marketing Management - Managerial Accounting - Financial Management - Electronic Commerce Marketing Management - Operations Management - Organization Behavior - Market Research

Research Assistant: Mechanical Property Evaluation of Single-walled Carbon Nanotubes by Finite Element Modeling; designing Germanium zone refining equipment. Teaching Assistant: Engineering Materials, Vibration, Dynamics, Air Pollution Control

Research of The Abrasion Experiment and Research of Activated Diamond Galvanized Tool