WoonKyung Lee
Senior Vice President @ Samsung Electro-Mechanics
About
MLCC and Package substrate . Process and equipment improvment at SAMSUNG ELECTRO-MECHANICS by Dec 2022. 3D NAND ( V-NAND ) creator . Built the 3D NAND process platform of Samsung semiconductor. : Developed the 1st to 4th generaton 3D NAND : Expertise of PI, YE and Device Engineering . Investigated the Future 3D NAND by 2019. e-mail : doowee3@gmail.com
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South Korea
Electrical & Electronic Manufacturing
반도체, 프로젝트 관리, 반도체 업계, 통합팀관리, 수율
Experience
Senior Vice President
Samsung Electro-Mechanics
Process and equipment developer in MLCC, Package substrate and 3D semiconductor
Advisor
Samsung Electronics
화성
New technolgy surveyer for the future 3D NAND
상무, Vice President
Samsung Electronics
대한민국 경기도 화성
the creator and developer of Samsung's 3D NAND
Education
Korea Advanced Institute of Science and Technology
화학
WoonKyung Lee's Contact Information
Phone
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