William （zi’an）

Arch ED, SS @ Lenovo

About

Founder of main PDT of Hisilicon. Having created Kirin & Balong & media chip (little hisilicon) and implemented from specification to products successfully after overcoming challenges and difficulties, which makes Hisilicon one of main industrial fabless vendors.

Country

China

City

Xicheng Qu

Industry

Semiconductors

Skill

半导体, 嵌入式系统, 集成电路, ASIC, 系统芯片, processor, soc, AP, Baseband, ARM 架构, 数位信号处理器, GPU, AI , Android, llvm, CUDA, 异构计算, volta, 低功耗设计, 性能分析

Experience

Arch ED, SS

Lenovo

2022-6 - 2025-12 · 3 yrs 7 mos

海淀区

Windows on ARM.

Senior Director R&D / Chief chip Architect

vivo

2020-1 - 2022-5 · 2 yrs 5 mos

BJ/SH/SZ/HZ

Chief cpu/soc/AI architect of PDT, hisilicon

Hisilicon

2005-9 - 2020-1 · 14 yrs 5 mos

Chief cpu/soc/AI architect of PDT, hisilicon 1. DTV 2. kirin & balong 3. arm64 cpu 4. DSP (4G/5G） 5. Davinci

lead cpu/soc/AI architect

Hisilicon Semiconductor Co. Ltd, HUAWEI Electrical P.R.China . (Beijing Branch)

2016-1 - 2019-10 · 3 yrs 10 mos

beijing

Project: ARMv8 CPU & AI core • AI architect of project (Davinci arch, in kirin & cloud) • cpu architect of project enyo (ARM's ADP, Austin) • cpu/soc architect of project (Hisilicon in-house armv8 CPU)

Chief SE of Balong & kirin

Hisilicon Semiconductor Co. Ltd, HUAWEI Electrical P.R.China . (Beijing Branch)

2012-8 - 2016-1 · 3 yrs 6 mos

beijing

Project: LTE 4G communication & AP chip(Balong & Kirin) Honors: “Special Contribution Award“ Only One, Awarded by Hetingbo, The President of Hisilicon, for Kirin Project. • Chief SE of BOTH project (AP & Modem/K3 series & Balong V7 series) • Member of Expert Tech Group(GPU,5G,CPU,DSP,NPU) • In charge of in-house DSP design.(Hifa)

Chief SE of Balong

Hisilicon Semiconductor Co. Ltd, HUAWEI Electrical P.R.China . (Beijing Branch)

2008-8 - 2012-8 · 4 yrs 1 mo

beijing

Project: LTE 4G communication chip – first 150MB/50MB UL/DL in the world. Honors: Special Contribution Award for Balong project.

SE & PM of DTV

Hisilicon Semiconductor Co. Ltd, HUAWEI Electrical P.R.China . (Beijing Branch)

2005-8 - 2008-8 · 3 yrs 1 mo

beijing

Project: Highly-integrated, cost-effective audio/video media chip -- No.1 in this area. • chip specification and Project Management • In change of SOC architecture, design and verification. • Audio/Video codec, MPEG, DAC knowledge