Will Chen, Ph.D.

Lead Advanced Packaging Solutions & Engineering group, -Drive pathfinding and packaging solution exploration, including key design features and architectures for future products -Shape the product roadmap with advanced packaging design solutions, aligned with system performance, power, thermal, manufacturability, and cost requirements -Enable packaging technology readiness and design implementation, ensuring on-time product tape-out and NPI execution -Develop 2.5D/3D packaging technologies with ecosystem partners including TSMC, Intel, OSATs, and EDA vendors to scale advanced packaging solutions into production

Tech lead for developing advanced 2.5D CoWoS packaging and delivering high-performance package solutions by integrating components such as voltage regulators and active Si bridges, aiming to advance AI and HPC-related products to the next milestone. Direct substrate technology development for 2.5D packaging, collaborating with suppliers like IBIDEN and UMTC, exploring substrate schemes and materials such as low Dk/Df ABF, low CTE and multi-layer core. Lead forward-looking expert teams in pathfinding the next generation of CoWoS technology, enhancing signal/power integrity, expanding package reticle size for greater chip integration, and delivering advanced AI/HPC packaging solutions.

Managed Failure mode and effects analysis (FMEA) for process control, yield improvement, and reliability enhancement, resulting in the qualification of developing projects ready for production transfer.

Resolved customer product failures by identifying root causes and providing solutions for package design improvement, addressing cases from R&D advanced packaging, including InFO and CoWoS, to customer products and end-user field returns.