Weidong Zhang

Act as PDT lead and EPM- 1, Define next-generation NAND solution, drive the NAND component business across key customers including AWS and China enterprise SSD makers 2, Lead cross-functional teams to plan product development schedules and oversee execution through important development milestones towards successful mass production 3, Drive program engineering schedules, make proactive risk assessment & risk mitigation, make technical and priority decision 4, Serve as the key interface between customers and internal teams, ensures alignment between customer product requirements and the internal NAND roadmap 5 ,Provide regular project update to leadership team

1,Define emerging memory & 3D NAND flash datasheet verification, product validation, characterization and wafer sort flow,including test methodology and test specification 2,Evaluate to select hardware(tester and prober card etc) based on new product feature 3,Develop test program and validate test mode/code with design simulation on pre-silicon stage 4,Lead team on post silicon debug and validation, report progress and co-work with related teams(design/device/process etc) for issue fix 5,Develop stress and screen at wafer level for latent defect accelerating and screening for DPPM reduction and improve reliability 6,Evaluate and provide solutions for yield improvement and test time reduction 7,Convert test program and perform correlation between different test platforms(advantest & magnum)

1,Leads engineering and customer sample (AI) builds till deliver with quality. 2,Manage the PLC (product life cycle) qualification activities to accomplish new technology product transition per schedule with Quality. 3,Consolidate key gap closure action items and drive execution 4,Facilitate collection of data required to make risk decisions,conduct phase review/toll gate meetings vs gating criteria((design/EVT,DVT,RDT,PVT to HVM – target yields, test time/UPH, Cpk, DPPM, Capacity, Materials, etc)

1,Drive test process optimization, yield improvement, hold lot disposition, cost reduction, capacity improvement, MRB material disposition, failure analysis on low yield lots. 2,Hands on EFA on Nand flash failure, checkout and release new test program for production 3,Work closely with corporate R&D and NPI teams to ensure smooth new product transition

1,Control test program and checkout new test program release to production 2,Oversee installation, set up and buyoff new test equipment/ test tooling 3,Responsible for failure analysis of product yield improvement to meet yield and quality targets

1,Perform system integration function test(hardware and software), electrical failure analysis and trouble-shoot the technical issues, cooperate with related stakeholders for continue improvement 2,Lead and coordinate multiple-functional team members to smoothly drive project transfer/product localization of electronics system products from overseas to Flex factory 3,Support customer design team for new product development