Walter Piltz

Tresky is a high-precision special-purpose machinery manufacturer focused on flexible, fully automated Die Bonder systems. We develop customized machines and solutions tailored to individual customer requirements. Our core strengths include flexibility, service, process development, and advanced Die Bonding technologies. My responsibilities include: Conducting internal machine acceptance tests to ensure compliance with functionality and high-quality standards Providing international customer training and on-site installation of Die Bonder systems Delivering global technical support to efficiently resolve customer issues Organizing and executing customer demonstrations and sample testing to showcase system capabilities Engaging in process engineering and prototype development for Die Bonder applications Driving innovation by contributing to the development of new modular systems and Die Bonding processes

At Sicoya, I am involved in the development and optimization of monolithically integrated silicon photonics solutions for connectivity, sensing, and computing applications. The dynamic environment, shaped by frequent new products and prototypes, ensures a varied and technically challenging workday. Key responsibilities and tasks: Manual assembly of PI Hexapod-based prototypes for development projects (e.g., laser micro package active coupling, fiber-to-chip coupling — active and passive), including measurement series, documentation, and evaluation Process monitoring: troubleshooting, equipment maintenance, process optimization and adjustments (software, hardware, workflows), regular quality spot checks Onboarding and training of new employees Reference measurements and analysis of “golden samples” Shear testing using Dage systems Operation of FiconTec equipment (fiber array to chip coupling, laser micro package to chip coupling) Use of Datacon machines for assembly processes, wafer singulation, adhesive bonding Operation of Tresky systems for adhesive bonding and placement tasks Visual inspections and documentation using Keyence systems Presentation of process equipment during investor and customer tours Participation in FMEA (Failure Mode and Effects Analysis) Evaluation of new materials, adhesives, and processes

Experience in quality assurance of electrostatic clamps (ASML wafer handling) under cleanroom conditions, with responsibilities including: Use of SAP system for handling error notifications, inventory bookings, and process tracking Operation and setup of 3D coordinate measuring machines (CMM) Optical measurement of lithographic structures using SmartScope systems Performing pneumatic pressure tests Final inspections before shipment, including protocol creation and final reporting Various optical inspections using measuring instruments and microscopes Documentation and error report creation Training and onboarding of new employees

Key practical experiences during my vocational training in a cleanroom and high-precision manufacturing environment included: Performing cleanroom particle measurements with documentation and analysis Maintenance and servicing of production machinery Solder ball placement using various processes (e.g., SB² bumping, GBP wafer process) Operation of nickel/gold plating systems Quality control across multiple process steps, including reporting and documentation Shear testing using Dage equipment X-ray inspection following solder ball processes Precision mechanical manufacturing of internal machine components Electroplating of internal mechanical parts Manual laser welding under laboratory conditions Operation and maintenance of laser marking systems Photolithographic processing (coating, exposure, developing)