Wallence Peng

1. New ALD Gate Stack Integration Processes Penetration – SiGe / Ge channels 2. High-k layers – Single and Batch ALD process a. Si channel Gate stack Vt modulation and integration b. CIS Backside Passivation c. CIS Trench Fill – line guide and Dark Current Reduction 3. Epi penetrations and New Applications Development a. New Pre-CLN process analysis and penetration b. CIS application engagement – Selective SiB c. New Channel EPI Layers d. Power Devices – IGBT and Power MOSFET (Super Junction) 4. ALD Metal Gates – Metal Carbide and TiN for FinFET NMOS 5. PEALD Processes Application Developments and Penetrations a. PEALD B/PSG Solid State Diffusion for FinFETs conformal doping b. PEALD BSG Solid State Diffusion for CIS peripheral doping to reduce noise c. PEALD SiO2 and Metal Oxide for SDDP application at N10 and beyond d. PEALD Metal Oxide and Metal Nitride for FinFET MEOL and BEOL ESLs (RC Reduction) e. PEALD Single Wafer SiNx for 3D FinFET applications f. PEALD Metal Oxide for CIS backside passivation 6. Batch ALD Al2O3 for Solar PERC cell a. Customer Capacity and Roadmap Investigation b. Mapping Customer Technology Status c. Customer Expansion Plan 7. LED Market and Applications survey a. Integration flow analysis and Identify ASM opportunities b. Marketing support c. Urge Customers Engagements

1. Assist account team to develop and maintain technical projects and customer engagements 2. Tool (Implanter) ASP / GM / MS Maintenance & Development 3. Identify New Applications , Establish JDPs 4. CIS application marketing and application support

1. Ion implants for High CE Solar applications, Process development and demonstration. 2. New Solar Customers development , Identify Customer Roadmap and Plan 3. Ion implants for High LOP LED applications, process development / demonstration and customer engagements. 4. Technical Marketing Support / TAM Growth Development – Solar , LED and Semi 5. Seeding and Prompting Ion implantation for CMOS Integration to meet Device Performance Yield (DPY) enhancement and Precision Material Modification (PMM) 6. Find out customer High Value Problems through technical engagements. 7. Cryo and Hot implants for advance CMOS transistor / memory devices development

PECVD Process engineer - ASM 1. Qualify and Maintain tool process performance at customer sites 2. Process CIPs to against competition ex: Throughput, Stability..etc. 3. Marketing support for tool promotions Polygon technical process specialist - ASM 1 Qualify and Develop new ALD processes for customers applications 1.1 ALD High-k dielectrics and metals for logic CMOS application 1.2 ALD high-k dielectrics for memory application ex: eDRAM / Flash / RF-Mix Signal 1.3 RTCVD processes for poly-Si /SiGe gate application, 1.4 High-k Gate Stack Interfacial Layer Engineering 2 JDP Project Owner – Project(s) Coordination and Control ; Customer Interface 3 Perform New processes development / Demo support at BU 4 Technical Marketing Support & Demo Technical Consultant Epi/TCP Section Manager - ASM 1. Lead HW & PE customer service support team 2. Support RD tool conversion to HVM transition. 3. Team Building and Training 4. Customer / Factory Interface Management 5. Technical Marketing Support for ASM EPI and ALD (TP/CP) products 6. New Penetrations support , identify projects 7. Product(s) CIP – HW / Process Process Manager - ASM 1 Lead all process support team for ASM products – TP / CP / EPI / Furnace 2 Project(s) Owners 2.1 Process Qualification / CIPs 2.2 Competition Information Collection 2.3 Demo Engagements and Consultant Support 2.4 Project(s) Coordination – SW/HW/Process 3 Sales / Marketing Support 4 BU support