Tsun Ming Wang

SEMI Research Manager, Market Intelligence Team 1. Focused on supply chains, revenues, technology and market trends of Advanced Packaging (e.g. 2.5D / 3D IC, SiP, FOWLP, and FOPLP) for Outsourced Semiconductor Assembly and Testing (OSAT), Foundries and IDMs, Compound Semiconductors (SiC, GaN, GaAs, InP, the 4th generation semiconductors, etc.), and Equipment and Materials suppliers. 2. Collected data and company visits for OSAT Report. 3. Assisted in Global Semiconductor Packaging Materials Outlook (GSPMO), Worldwide Semiconductor Equipment Market Statistics (WWSEMS), and Worldwide Assembly & Test Facility Database Reports in 2024 and 2025. 4. Publications: (1) GSPMO, 2024 Edition, co-author, SEMI and TechSearch (10/24). (2) Worldwide Assembly & Test Facility Database, 2025 Edition, major author, SEMI and TechSearch (06/25). (3) Glass Core Substrate Market And Development Trends, co-author, Global Net Corp. and SEMI (05/26). 5. Presentations: (1) "2025 Semiconductor Market," SEMI Industry Member Networking Luncheon, Taiwan (02/25). (2) "Semiconductor Market Trends and Forecasts," Bloomberg Forum, Taiwan (07/25). (3) "Semiconductor Market Trends and Forecasts," TAMI, Taiwan (09/25) (4) "2026 Semiconductor Markets and Trends," SEMI Industry Member Networking Luncheon, Taiwan (01/26). 6. Business Travels: (1) 17th IC Packaging and Testing Forum (CIPA 2025), as well as CSEAC 2025 and companies visit, China (09/25). (2) SEMICON China 2026 and companies visit, China (03/26).

DIGITIMES Inc. Analyst, Research Center 1. Focused on energy, power, communication, and EV develop. of compound semi. supply chains (from substrate, epi, IC, tier1, brand, to end customer) in RF (GaAs, GaN and InP), power (SiC and GaN), and optoelectronic devices (GaN, GaAs and InP), etc., as well as edited Research Reports for market trends. 2. Conducted research on develop. of future trends of the 4th gen semi. (AlN, diamond, and Ga2O3). 3. Collected global OSAT for advanced packaging (SiP, CoWoS, EMIB, X-Cube, etc.). 4. Special Programs (5 times): (1) Two Compound Semi. reports, for ITRI program, the 1st author (11/22). (2) Top 20 OSATs in Great China, for the customer program, the co-author (06/23). (3) Global Compound Semi. in 2023, for ITRI program, the 1st author (12/23). (4) Investment for Semi. Industries in Vietnam, co-author (03/24). 5. Oral Presentations (12 times): (1) ITRI programs for compound semi., at Tainan and on-line, Taiwan (06/22, 10/22 & 06/23). (2) DIGITIMES programs for compound semi., at Taipei and on-line, Taiwan (08/22, 12/22, 03/23, 10/23, 03/24 & 07/24). (3) "Supply Chain and Market Analysis of Wide Bandgap Semi.," for a governmental lecture, at Kaohsiung, Taiwan (09/22). (4) "Develop. Trend of Compound Semi. Industries," for TEEMA invitation, at Tainan, Taiwan (11/22). (5) "GaN Trends of Develop. and Tech," for ROHM invitation, at Taipei, Taiwan (05/24). 6. Podcast: (1) "Have You Bought a GaN Fast Charger? ," IC Broadcasting Co., Ltd. (09/22). 7. Press: (1) "Infineon to Acquire GaN Systems, May Open The 3th Gen Semi. Emerging Business Model," 1st author, DIGITIMES (03/23). (2) "IQE CEO Americo Lemos: Taiwan to serve as key base for compound semi. in Asia, " co-author, DIGITIMES Asia (10/23). (3) "SiC market prospects and strategies: Interview with Onsemi VP of Industrial Power Division, PSG, " 1st author, DIGITIMES Asia (05/24). 8. Business Travel: (1) Semicon Japan 2023, as well as companies and colleges visit, Japan (12/23).

DRAMeXchange, TrendForce Corporation Industry Analyst, Semiconductor Research Division 1. Focused on developments of advanced packaging (SiP, CoWoS, AiP, EMIB, X-Cube, etc.) and mature packaging (Wire Bond, QFN, TO, BGA, etc.) for technique, supply chain, revenue, CAPEX, utilization rate, etc. 2. In order to predict the future trends of the outsourced semiconductor assembly and testing (OSAT), as well as compound semiconductors (GaAs, GaN, SiC, etc.), edited Focus Reports monthly, and Press Releases untimely. 3. Publications: (1) Chinese OSATs now and future report in China Times Group, 1st author (04/21). (2) Antenna in Package (AiP) report in China Times Group, 1st author (07/21). 4. News Press Releases: (1) Ranking reports for the top ten in OSATs in 1Q21, 2Q21, and 3Q21, 1st author (05/21, 09/21, and 11/21). (2) MCO 3.0 in Malaysia for packaging and passive industries, co-author (06/21). (3) Developments of 3rd Gen Semiconductors in 2021, 1st author (09/21). (4) Chipbond and UMC via strategic partnership in blog, 1st author (09/21). (5) 10 Tech Industry Trends (3rd Gen Semiconductors) for 2022, co-author (09/21). (6) Trends of Advanced Packaging: FOPLP in blog, 1st author (11/21). (7) Heterogeneous and EDA Tools for 2.5D/3D IC Package in blog, 1st author (01/22). (8) China's OSAT has emerged from the pandemic a champion in blog, 1st author (02/22). 5. Oral Presentations: (1) "Without Fear of US-China Trade War and COVID-19 Pandemic, Semiconductor Development Is Bottoming Up during 2021," for AUDIX, at Taipei City, Taiwan (05/21). (2) "Comprehensive Analysis of The Third-generation Semiconductor Market and Application, " for TrendForce, on-line presentation (11/21). 6. Internal Training: (1) Trends in advanced packaging (08/21). 7. Training Experiences: (1) Third-generation Semiconductor Gallium Nitride (11/21). (2) The Past, Present, and Future of Packaging (11/21). (3) Focusing on Key Technologies and Applications of Compound Semiconductors (11/21).

Topology Research Institute, TrendForce Corporation Industry Analyst, Semiconductor Division 1. Focused on developments of (1) compound semiconductors in RF Front End (GaAs, GaN, and silicon on insulator/SOI), Power Devices (GaN, SiC, and SOI), and 3D Sensing (GaAs and SiGe), and also (2) passive devices (Capacitor, Resistor, and Inductor), as well as (3) advanced packaging industry (SiP, CoWoS, AiP, EMIB, X-Cube, etc.) for techniques, supply chains, competitor analysis, etc. 2. In order to predict the future trends of compound semiconductors, passive devices, and outsourced semiconductor assembly and testing (OSAT), edited Focus Reports, News Scans, and Press Releases. 3. Publications: (1) Epitaxy report in China Times Group, 1st author (03/19). (2) VCSEL report in China Times Group, 1st author (11/19). 4. News Press Releases: (1) Ranking reports for the top ten in OSATs in 1Q19, 3Q19, 1Q20, 2Q20, and 3Q20, 1st author (19-20). (2) "Strong Growth Expected for Third-Generation Semiconductors in 2021," 1st author (03/21). 5. Oral Presentations: (1) "Opportunities for the Next Era Semiconductor Industry - 3rd Gen Semiconductors," for Nantong officials, China (12/19). (2) "Demand Is Calling, Compound Semiconductor Situation Is Reappearing," on-line presentation (04/20). (3) "Advanced Packaging and Testing to Create Opportunities for Applications," for Risheng Securities, at Taipei City, Taiwan (09/20). (4) "Seize the Opportunity, 3rd Gen Semiconductor Outlook," for TrendForce, at Taipei City, Taiwan (03/21). 6. Training Experiences: (1) Single Crystal Growth Technology and Market Introduction for Power Devices (03/19). (2) SiP Global Summit – Heterogeneous Integration NOW & FUTURE 2019 and 2020 (19-20). 7. Business Travel: (1) 3rd Gen Semiconductors Trends, for Nantong officials, China (12/19). 8. Co-constructions: (1) Mobile (19-21). (2) Semiconductor (20). 9. Internal Training: (1) Trends in compound semiconductors for vehicles (04/21).

SYMBIO, INC. Product Development Engineer, Technology Division 1. Synthesize the recipes of rubber and acrylic (including resin, crosslinking agents, stabilizers, etc) on PET and PVC substrates, for the pressure sensitive adhesives. 2. Inspected in physical properties of the pressure sensitive adhesives, such as "Peel Strength," "Rolling Ball Tack," "Unwinding Force," "Tensile Strength," etc. 3. Translated Engineering Specification of SAE (Society of Automotive Engineers) International to Chinese, to figure out testing methods for physical protection of wiring harnesses (tapes).

Green Energy and Envir. Research Lab., Industrial Technology Research Institute (ITRI) Associate Researcher, Intelligent Energy-Saving System Division 1. Researched in new products designs of synthesis and granulation for adsorbent materials (MOFs, silica gel, zeolite, etc.), while combined with Patent Analysis, TRIZ, and Design Thinking. Further, won contests and created new values for the next era, like (de)humidifier, VOC processing, etc. 2. Utilized Industry Analysis to find out market demand for adsorbent dehumidifier, and further performed tests in elements of dehumidifier (e.g., PTCR devices). Also, finished two ITRI technique reports in 2016 – 17. 3. Executed project management of commissioned energy efficiency research programs from 2016 to 2018, for Bureau of Energy, Ministry of Economic Affairs, Taiwan, and also published three execution reports in 2017 – 19. 4. Results and Publications: (1) ITRI technique report, "The study of the regeneration techniques in the mini household silica gel adsorbent dehumidifier," the first author (2017). (2) 3 execution reports of commissioned energy efficiency research programs in 2016 to 2018, for Bureau of Energy, Ministry of Economic Affairs, Taiwan, the co-author (2017 – 19). (3) ITRI technique report, "The study of the mini household adsorbent dehumidifier and the water vapor ad/ desorption of silica gel," the first author (2016). 5. Awards and Honors: (1) Contest of Innovative Project Ideas for Market Demand, The Selected (2018). (2) Language (French) Training Program by French Office in Taipei, The Selected (2017). (3) ITRI Patent Map Search and Analysis Group Contest (Topic: Next Era Applications of MOFs), 1st Place (2016). 6. Training Experiences: (1) Project Writing and Management Strategy (2017). (2) Design Thinking Workshop (2017). (3) TRIZ Workshop (2016). (4) Patent Map Search and Analysis (2016). (5) Industry Analysis and Practical Research (2016). 7. License: OHSAS 18001 Internal Auditor (2017).

Innolux Corporation, Foxconn Group Technology and Development Engineer, LCD Platform, Technology Division 1. Researched and analyzed in new product developments of the channel layer in IGZO (amorous InGaZnOx) TFTs, as well as process tuning and integration of ESL (Etching Stop Layer) and BCE (Back Channel Etched) types in IGZO. (Physical and Chemical Properties by XPS, XRR, SEM, τ-plot, SIMS, and μ-PCD analysis, and Electrical Tests by Rs and I-V measurement.) 2. Studied in growth mechanisms and material properties of novel TCOs (Transparent Conductive Oxides), such as IGZTO (amorous InGaZnSnOx), CAAC (C-axis Aligned Crystal) IGZO, etc. 3. Inspected in module and cell tests of IGZO TFTs for different treatments, as "Storage (-20 ~ 100℃) and Start Test," "High Temperature and Humidity Storage," "Modulated in High/ Low Gate Voltage," etc. 4. Training Experience: 6-sigma Green Belt (2015). *Production line of IGZO TFT-LCD (with 8 to 12 inches) at Innolux was built up in 2016. (https://www.gsmdome.com/innolux-plans-upgrade-factory-order-produce-igzo-tft-lcd-panels) *4K IGZO (screen with 13.3 inches) low frequency 20Hz ultra thin narrow bezel panel. (http://www.innolux.com/Pages/en/News/News324_en.html)

Compound Semiconductor Device Research Center, National Yang Ming Chiao Tung University (NYCU) Researcher (Lab. Assistant) 1. Investigated in epitaxial growth and device performances of III-V multi-junction photovoltaics (solar cells) and electrical devices. 2. Studied and researched in epitaxial growth of III-V compound semiconductors, such as GaN on patterned Si substrate by Metal-organic Chemical Vapor Deposition (MOCVD), to realize the growth mechanisms and factors (2009 - 2011). 3. Succeeded in directly growth of the next era channel layer of InAs thin film (40 nm) on GaAs/Ge by MOCVD, and also solved high lattice mismatch (7.2%) between InAs and GaAs/Ge (2011 - 2013). 4. Results and Publications: (1) Accepted patent: US 9,287,122 B2, "Method for growing epitaxies of a chemical compound semiconductor," the third author, and further signed a contract with TSMC (2016). (2) Published letter in J. Vac. Sci. Technol. B 32, 050601, "Direct growth of a 40nm InAs thin film on a GaAs/Ge heterostructure by metalorganic chemical vapor deposition," the second author (2014). (3) Oral presentation in EMR 2012, Malaga, in Spain, with the topic: "AlGaAs/GaAs tunnel diodes grown on misorientated GaAs substrates for InGaP/GaAs dual-junction solar cell applications," and also published the conference paper in "Fuelling the Future," the second author (2012). 5. Business Travel: (1) Oral presentation and published a conference paper in EMR 2012, Spain (2012).

Compound Semiconductor Device Lab., NYCU 1. Relevant Courseworks: Epitaxy, MOCVD, Semiconductor Process and Manufacture, PV & Devices (Si, Ge, III-V, etc.). 2. Investigated in epitaxial growth and device performances of III-V multi-junction photovoltaics and electrical devices. 3. Succeeded in directly growth of channel layer of InAs thin film (40 nm) on GaAs/Ge by MOCVD. (1) Created the next era channel layer, and solved high lattice mismatch (7.2%) between InAs and GaAs/Ge. (2) Thesis Title: "Direct growth of InAs/GaAs heterostructure on Ge substrate by MOCVD." 4. GPA: 90.42/100. 5. Scholarship: "Taiwan HOPAX Chemicals MGF Co. Scholarship" (2012). 6. Publications: (1) Accepted patent: US 9,287,122 B2, "Method for growing epitaxies of a chemical compound semiconductor," the third author, and further signed a contract with TSMC (2016). (2) Letter in J. Vac. Sci. Technol. B 32, 050601, the second author (2014). (3) Oral presentation and conference paper in EMR 2012, Spain (2012).

National Yang Ming Chiao Tung University (NYCU) 1. Relevant Courseworks: Physical and Chemical Properties in Material Science (for Semiconductor, Ceramic, Metal, and Polymer), Engineering Technology, Research and Design, Epitaxy, MOCVD. 2. Studied and researched in epitaxial growth of III-V compound semiconductors by Metal-organic Chemical Vapor Deposition (MOCVD). (1) Realized and analyzed the mechanisms of epitaxial growth, such as growth temperature, growth time, V/ III ratios, etc. (2) Monographic Study Title: "Epitaxial growth of GaN on patterned Si substrate by MOCVD." 3. GPA: 86.44/100 (Top 2% in 1H 2011). 4. Volunteer Experience: National Chiao Tung University International Volunteer Group: I-DO NCTU, in Indonesia (2010). 5. Awards, Honors, and Scholarships: (1) Chimei-Innolux Corporation Scholarship, for Master Student in Scientific Fields (2011). (2) Wen-Chen Bai T50 Dream Fund, for National Chiao Tung University International Volunteer Group: I-DO NCTU (2010).