TONGQING CHEN
Etch process lead @ IBM
About
礼义廉耻 Now moving into 2nm. Have fun there. 28 years in Dry Etch and experienced with most of processes from gate all the way to pad, starting with 0.8um tech node
United States
Ballston Spa
Semiconductors
Semiconductors, IC, CMOS, Semiconductor Industry, Process Integration, Silicon, Failure Analysis, Design of Experiments, Thin Films, JMP, VLSI CAD, Yield, Microelectronics, VLSI
Experience
Etch process lead
IBM
United States
New role started
Etch Dep Senior Mgr
Hefechip Semiconductors
Memeber of Technical Staff
GlobalFoundries
US
Dry etch process engineer, from 0.8 um to 7nm.
engr
Chartered Semiconductor
Education
Beijing National Day School
Zhejiang University
TONGQING CHEN's Contact Information
Phone
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