Tongkun Zhao

Head of ASML HMI DE CN

Head of ASML HMI DE CN

Lead of high performance electronics system design of semiconductor equipment 1. High speed data acquisition, processing and image data distribution system design. 2. e-beam control system design 3. Solid experience in VHDL and C coding . 4. Lead several teams(cross country teams) to conduct electronics system design. 5. High precision signal system design includes analog front-end circuits, low-noise amplifiers, high speed A/D and D/A, op-amp, wide bandwidth amplifiers, passive and active filters。 6. High speed digital circuits design including LVDS, DDR, PCIe, USB, Ethernet, and fiber communication, which are based on MCU, DSP, and FPGA. 7. High frequency or high speed circuits design and experience, including signal integrity and power integrity, transmission line, noise analysis, high-speed circuit layout, high-density BGA, and EMC analysis. 8. Proficient in SI and EMI suppression techniques including impedance matching, grounding, shielding, decoupling, cabling, ferrite beads, chock, etc.. 9. Thermal design and analysis including heat sink and fan selection. 10. Experience in image scan and pre-processing systems and supporting sub-system level and system level integration. 11. Experience of prototyping, conceptual design, feasibility analysis, components selection, hardware bring-up, debugging, and full function bench test. 12. Cross-functional experience with firmware team and mechanical team and dealing with supply chains and outsourcing manufacturing partners. 13. Experience of schematic capture, circuit simulation, PCB layout and providing detailed layout guidance. 14. High performance analog and mixed signal circuit design Architect of electronics sub-system 1. Make electronics system/sub-system level architecture design 2. Transparent system level spec to subsystem/module level 3. Supervise junior and senior engineers in EE department

Lead of high performance electronics system design of semiconductor equipment 1. High speed data acquisition, processing and image data distribution system design. 2. e-beam control system design 3. Solid experience in C and VHDL coding . 4. High precision signal system design includes analog front-end circuits, low-noise amplifiers, high speed A/D and D/A, op-amp, wide bandwidth amplifiers, passive and active filters。 5. High speed digital circuits design including LVDS, DDR, PCIe, USB, Ethernet, and fiber communication, which are based on MCU, DSP, and FPGA. 6. High frequency or high speed circuits design and experience, including signal integrity and power integrity, transmission line, noise analysis, high-speed circuit layout, high-density BGA, and EMC analysis. 7. Proficient in SI and EMI suppression techniques including impedance matching, grounding, shielding, decoupling, cabling, ferrite beads, chock, etc.. 8. Thermal design and analysis including heat sink and fan selection. 9. Experience in image scan and pre-processing systems and supporting sub-system level and system level integration. 10. Experience of prototyping, conceptual design, feasibility analysis, components selection, hardware bring-up, debugging, and full function bench test. 11. Cross-functional experience with firmware team and mechanical team and dealing with supply chains and outsourcing manufacturing partners. 12. Experience of schematic capture, circuit simulation, PCB layout and providing detailed layout guidance. 13. High performance analog and mixed signal circuit design Architect of electronics sub-system 1. Make electronics system/sub-system level architecture design 2. Transparent system level spec to subsystem/module level 3. Supervise junior and senior engineers in EE department

High performance electronics system design of semiconductor equipment 1. High speed data acquisition, processing and image data distribution system design. 2. e-beam control system design 3. High precision signal system design includes analog front-end circuits, low-noise amplifiers, high speed A/D and D/A, op-amp, wide bandwidth amplifiers, passive and active filters。 4. High speed digital circuits design including LVDS, DDR, PCIe, USB, Ethernet, and fiber communication, which are based on MCU, DSP, and FPGA. 5. Solid experience in VHDL and VHDL C . 6. High frequency or high speed circuits design and experience, including signal integrity and power integrity, transmission line, noise analysis, high-speed circuit layout, high-density BGA, and EMC analysis. 7. High speed data acquisition and distribution design. 8. Proficient in SI and EMI suppression techniques including impedance matching, grounding, shielding, decoupling, cabling, ferrite beads, chock, etc.. 9. Thermal design and analysis including heat sink and fan selection. 10. Experience in image scan and pre-processing systems and supporting sub-system level and system level integration. 11. Experience of prototyping, conceptual design, feasibility analysis, components selection, hardware bring-up, debugging, and full function bench test. 12. Cross-functional experience with firmware team and mechanical team and dealing with supply chains and outsourcing manufacturing partners. 13. Experience of schematic capture, circuit simulation, PCB layout and providing detailed layout guidance. 14. Experience in a lab environment using oscilloscopes, spectrum analyzers, network analyzer, signal/function generator. 15.