Todd Farrell
Director Memory Pathfinding - Azure Hardware Systems and Infrastructure @ Microsoft
About
Todd Farrell has over 30 years of experience in computer architecture and engineering. Mr. Farrell worked for Tri-Star Computer Corporation in Phoenix, Arizona, where he led the engineering team in developing high-speed CAD/CAM computer systems for the aerospace and defense industries. In 1993, Mr. Farrell began his career with Micron, working in the Computer Division on the Client and Server Platform Engineering Team. Under his direction, the team won several industry awards, including PC Magazine’s Editor’s Choice Award. He later worked as Engineering Manager of the Platform Architecture Group, before transitioning to the Technical Marketing Applications Group in 2001 to focus on the development of DRAM products, where he became involved in the JEDEC Industry Standards Group. Mr. Farrell has contributed to several memory standards, including JEDEC DDR2, DDR3, DDR4, DDR5, and HMCC 15G-SR and 30G-VSR. In 2008, he received JEDEC’s Technical Recognition Award for his significant role in developing and authoring the JESD79-3 DDR3 specification. Mr. Farrell was a Senior member of Micron’s Technical Leadership Program and served as Micron Technology's primary representatives for the following Industry Standards: JEDEC Board of Directors, Gen-Z Board of Directors, HMCC Developer, OpenCAPI Board of Directors, and participates in many other standards organizations. He holds 26 U.S.-issued patents in the areas of computer and memory architecture. Todd's current position with Microsoft is with the Leading Edge Architecture Pathfinding team as part of the Microsoft Azure Hardware Architecture (AHA) group. Todd also represents Microsoft Corporation on the JEDEC Board of Directors.
United States
Boise
Semiconductors
Technical Marketing, DRAM, Product Development, Computer Architecture, Semiconductors, DDR3, Product Management, Software Development, Embedded Systems, Hardware Architecture, IC, SoC, Semiconductor Industry, DDR2, Dynamic Random-Access Memory (DRAM), Integrated Circuits (IC), Electronics, Mixed Signal, Flash Memory
Experience

Director Product Architecture
Boise, Idaho Area
• Board of directors for several standards organizations (JEDEC, OpenCAPI, and Gen-Z) • Primary Standards representative for above plus MIPI Alliance, Open Power, and CCIX • Technical Leadership Program (TLP) Review board for Systems Expertise • Lead DDR5 architecture team working with ecosystem partners • Defined roadmap of components, modules, and support devices (Registers, PMIC, Buffers and Hubs)

Director Technical Marketing
Boise, Idaho Area
• Led multiple teams including Applications Engineering Team (factory memory experts), Ecosystem Partners (including CPU, GPU, ASSPs, FPGA) for Compute and Networking Business Unit • DRAM Architecture and product definition for several DRAM projects both custom and industry standards including DDRx, RLDRAM, HMC, and support of GDDR, HBM, and LPDDR • Memory Module development and support of all DIMM products (UDIMM, SODIMM, L/RDIMM) • Memory channel SI simulations, module and component power, performance modeling, and PDN analysis • HMCC Standards development; created and established a new HMC consortium, workgroups to drive PHY and Protocol specifications and ecosystem development. High speed SerDes SR-15 and VSR-30 products defined with 3DI packaging including TSV /w heterogeneous mix of Logic foundry and Dram foundry. Custom 3D stack memory for Intel Xeon PHI product.

Architecture Development Engineer
• DDR4 product/roadmap definition, all DRAM features, functions, parametrics, and module development • DDR3 product/roadmap definition, all DRAM features, functions, parametrics, and module development • Multiple Innovation projects outside of JEDEC standard memory products • JEDEC Technical Recognition award 2007 for JESD79-3 (Author of DDR3 full specification JESD79-3)

Applications Engineering Manager
Boise, Idaho Area
• Promoted to Senior member of Technical Staff (Technical Leadership Program) • DDR3 product definition/roadmap, all DRAM features, functions, and parametrics, and module dev. • DDR3 chair of JEDEC AC Parametrics task group and several others including SI and Packing TG’s

Strategic Applications Engineer
Boise, Idaho Area
• DDR2 product definition, all DRAM features, functions, and parametrics • Author of both internal design specifications and external customer product datasheets • DDR2 vice-chairman of JEDEC JC42.3c Committee and Chair of multiple DDR2 Task Groups • Responsible for PC100/PC133 SDRAM products and Rambus RDRAM PC600-800 • Author of several external DRAM datasheets used for customer support and design-in

Director Engineering
Boise, Idaho Area
• Initial core team start-up for motherboard development and production at Micron Technology • Hired and managed a 35+ team over a 3 year period with a $2.5M budget across multiple sites • Responsible for overall product roadmaps and selection of all silicon components including cpu, memory, audio, GPU, I/O, and networking components • Full motherboard design including verification and validation for schematic capture, board layout, BIOS, software drivers, and high-speed simulation environments for cpu and memory subsystems • Setup and managed multiple labs including motherboard compatibility lab, customer qualification lab, and regulatory FCC/EMI labs • Successfully developed, implemented, and passed audits for product development to ISO9001 standard

Engineering Manager
Boise, Idaho Area
• Founding member of Crucial Technology start-up, a division of Micron Technology • Responsible for Technical Support team, training, and software tool development • Author of original PC memory upgrade configuration tool using FoxPro database • Setup compatibility lab and qualification process for module upgrades

Engineering Manager
Nampa, Idaho
• Micron PC Division - Lead (25+ team) for both product qualification and compatibility labs for Client and Server based systems • Created and deployed in-house automated software download system to improve hardware and software qualification process for Engineering Lab and also leveraged this to a full scale OEM PC production environment that included 16 Novell SFT III server platforms serving 800 simultaneous clients with dynamic software configuration of Windows 95 and Windows NT based systems • Product development lead for both Client and Server market segments of x86 systems • Several awards and Editor’s choice for PC Week, PC Magazine, and Computer Shopper

Product Development Manager
Tri-Star Computer
Chandler, AZ
• Product development lead for high performance x86 CAD Workstations and Servers • Several awards and Editor’s choice for PC Week, PC Magazine, and Computer Shopper
Todd Farrell's Contact Information
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