Tim PENG

•Provides guidance/support to sales colleagues, assists in all sales activity of sales team. •Develops knowledge and collects data on the account's business, products, processes, growth opportunities and customer •Focuses on new business development, maintaining customer relationships and troubleshooting specific customer problems. •Understands the value of Linde's products and application technology in developing pricing recommend-actions. •Recognizes and expands opportunities at existing customers bringing solutions and value to customers. •Key Executive account improvement Project (CIP)__TSMC_3DIC_Advacned Packaging •Customer Penetration Project_Micron HBM_F16_F15 Front-end •NPI Start-up-- TSMC Panel_level_packaging

•MPP Group (Metals Packaging Products) provide core packing products (wafer level advanced Packaging) and solutions at applied Materials. •Dedicated for TSMC account (Logics: back-end of line “AL-PAD”. Packaging: metal film (TSV/RDL) •Advanced Packaging development on SoIC (3D packaging) at TSMC(AP2/AP6/F12) •Responsible for managing completion of assignments, ensure correct assignment for engineers to customer and product. •Review and monitors action plans to close issues to ensure customer satisfaction. •Participate in NPI, resolution of critical long-term customer issue with upper management (TSMC/ UMC/ Micron) •Identifying special projects for successful implement and completion (HVM/RD) •Provide level-3 Escalation for Hardware & Process (stability) issues. Drives FA (Failure Analysis) to identify long-term technical issues, the plan for resolution/ develops the design. •BU support (Singapore)-(Aluminum Pad Process for Back-end/Front -end), Support GPS---Generate documentation such as CENs and BKMs •Create/Review documentations (technical improvements/ system upgrades/ support plans.). Presents at customer level. Ensures field implementation. •Key account maintain/ tool performance and quality control/ RD Projects

PVD Process/APPLICATION engineer 1.Qualify and Maintain tool process performance at Keycustomer sites 2.Marketing support for tool promotions 3.Process CIPs to against competition ex: Throughput, Stability..etc. 4.Dry etch/ Metal RDL for Wafer level package process 5.Technical Training for key customer 6.Perform New processes development / Demo support at BU 7.Support RD tool conversion to HVM transition. 8.Product(s) CIP – HW / Process 9.BU support

1.Build in tool (BU manufacturing in UK) and QA test 2.Tool installation and inspection on customer site 3.Product improvement and CIP introduced

New product introduction

For taiwan customer provide all product related info/solutions (Retrofit/ install/ NC/FA )

24/7 technical support for worldwide ASM engineer

ASIAN ASSOCIATION, NORTHWESTERN POLYTECHNIC UNIVERSITY 10/2004--10/2006 Development Committee Member