Teo Yong Han
Senior Wirebond Equipment Engineer @ Texas Instruments
Malaysia
Selangor
Semiconductors
Data Analysis, C++, Analytical Skills, Microsoft Office, SQL, Problem Solving, Leadership, Project Planning, Troubleshooting, Creativity and Innovation, Failure Mode and Effects Analysis (FMEA), Machine Operation, Mechanical Troubleshooting, Productivity Improvement, Process Quality Improvement, Continuous Improvement, Communication
Experience
Senior Wirebond Equipment Engineer
Texas Instruments
Melaka, Malacca, Malaysia
Manufacturing Wirebond Equipment Engineer
Texas Instruments
Malacca, Malaysia
1) Wire Bond Equipment Engineer [ Jan 2022 - present ] 2) Post bond inspection (AOI) Equipment Engineer [ June 2023 - present ]
Test Engineering Intern
Texas Instruments
Melaka, Malacca, Malaysia
Education
Universiti Teknikal Malaysia Melaka
Electrical Engineering Technology (Industrial Power)
Teo Yong Han's Contact Information
Phone
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