Teik Liang Chew

• Lead technical operations for process and backend assembly equipment, ensuring high reliability, utilization, and performance. • Develop and execute technical and operational plans aligned with cost, productivity, quality, and long-term equipment roadmap objectives. • Plan and control engineering schedules covering customer builds, ECN implementation, and capacity planning. • Drive continuous improvement initiatives focused on cost reduction, process optimization, and yield enhancement. • Collaborate with production, quality, and customers to balance capacity demand, optimize line layouts, and resolve technical issues. • Lead customer corrective action responses, ensuring timely root cause analysis, corrective actions, and closure. • Mentor and develop engineers by assigning ownership of technical issues, corrective actions, and improvement projects

• Led technical operations supporting 140 testers for wafer probe and package test processes. • Supervised 6 engineers and 8 technicians, ensuring seamless operations and customer satisfaction. • Achieved significant reductions in machine downtime and improvements in test yield and capacity. • Managed NPI activities, including system installations, equipment upgrades, and product transfers. • Expert in ATE systems: Teradyne, LTX, Chroma, and Agilent. • Developed preventive maintenance procedures and corrective action plans to ensure test system reliability.

• Supported test system debugging and maintenance for hardware and software applications. • Improved test yields and ensured consistent system calibration and reliability. • Conducted training for production operators and maintenance teams to enhance technical competency.