TAMILAN ELANGO

 Signal and Power Integrity and reliability Engineer with 7 Years of Experience in Simulation, Reliability and PCB like Automotive Aerospace, Telecommunication, Mobile Industry and Defense Applications. Perform Pre-Layout &Post-Layout simulations Extraction of S-parameter models using 2.5D, 3D solvers. Frequency Domain simulations (IL,RL,FEXT,NEXT) and Perform Time Domain (TDR) S-parameter extraction of Board to analyze Insertion loss and Return loss. PKG analysis for violations like passivity, reciprocity & causality. SI simulations of different types of DRAM with different chip sets using HSpice or Mobile, Enable Pre-Emphasis for DRAM, Enable Equalization in Read &Write Modes for LPDDR5X.Vref training for Read & Write, CA waveforms Implement JEDEC specifications for different DRAM standard/configuration Eye diagram analysis in Read &Write Modes of DRAM for Aperture, Noise Margin, Reflection &Crosstalk issues. Analysis of different types of DRAM for different simulation setup conditions Familiar with Differential Via modeling and impedance optimization techniques. Work with DRAM vendors for possible solutions to failures observed in SI simulations. Hands on experience on S-Parameter extraction using cadence Sigrity, Ansys HFSS 3D Layout tool, SERDES, IR Drop and LPDDR4 and LPDDR5x batch Simulation for signal integrity validation. Hands on experience on DC Drop analysis, Loop inductance, Decoupling and optimization. Experienced in using IBIS (RLC & Comp), IBIS-AMI model parameters, Touchtone, Spice model simulation Board level simulation for signal traces to extract system performance parameters such as eye- diagram, Jitter etc Support Global Customer Engineering Team to resolve the issues seen in customer layout simulations Designed Multi-layer printed circuit boards. Designed up to 20layers, using latest technologies. Crosstalk and Reflection analysis for different interfaces Experience Requirements analysis, stack-up validation &PCB material selection for high speed design and capability of working with the layout team. Have Worked PCB Design like Cadence16.6&17.4, Altium Designer 20.0.9 and Development of Analog, Digital, RF & Mixed mode. Have Good Knowledge on placement and routing of RF, DDR3 /DDR4, PCIe, RGMII, BACKPLANE, USB3.0, JTAG & HDMI interfaces, Ethernet and minimize EMI/EMC issue in Power section. Good knowledge on stack up development for impedance and setting up various specific design constraints for fine pitch components and entire board