steven cheng
Senior Software Development Engineer
About
Managed key system integration projects in the semiconductor industry, acting as the primary point of contact between software development teams, hardware vendors, and end customers. Directed project planning sessions to align on integration protocols and timelines, maintaining open communication channels to address technical bottlenecks. Anticipated and mitigated integration challenges, including system compatibility and testing delays, by coordinating cross-functional problem-solving efforts. Delivered seamless integration of automated material handling systems (AMHS) into existing manufacturing infrastructures and ensuring on-time delivery within budget.
Malaysia
Federal Territory of Kuala Lumpur
Industrial Automation
Software Engineers, Systems Integration, Warehouse Automation, Mechatronics, Streamlining Process, Vendor Coordination, Automation, Supply Chain Collaboration, MySQL, Mechanical Drawings, CNC Machine, Automatic Control, Industrial Robots, Development Design, Electronics Hardware Design, Warehouse Control, Meeting Facilitation, .NET Framework, Remote Control, Inter-departmental Coordination
Experience

Senior Software Development Engineer
TecGlobal
Shah Alam, Selangor, Malaysia
Lead the design and development of system architecture, human/machine interfaces, and integration of AI powered machine vision system for various automation solutions. Coordinated key engineering projects by serving as the primary liaison among internal teams, vendors, and customers. Led project planning sessions, maintained open communication channels, and ensured alignment on technical specifications. Proactively managed risks, resolved conflicts, and achieved seamless integration of vendor-supplied components into customer-specific solutions.

Senior Software Engineer
TKGL Semiconductor (M) Sdn. Bhd.
Coordinated key engineering projects by serving as the primary liaison among internal teams, vendors, and customers. Led project planning sessions, maintained open communication channels, and ensured alignment on technical specifications to ascertain the successful completion of key projects of the company within budget and schedule. Proactively managed risks, resolved conflicts, and achieved seamless integration of vendor-supplied components into customer-specific solutions for automation projects, managing interactions between the engineering team, vendors, and customers to successfully deliver various company's key projects based at Malaysia office and main office in SuZhou, China. Facilitated scheduled status meetings to align engineering teams with customer requirements and vendor capabilities. Utilised .NET framework to design, develop and build control system for automated Semiconductor Process Solutions. Lead the design and development of system architecture, human/machine interfaces, and integration of AI powered machine vision system for various automation solutions. Designed and developed control system for Automated Parts Fabrication Production Line by implementing various of CNC machines and industrial robots. Lead and manage the development and implementation of an Automated Smart Warehouse system for customer's Semiconductor Inventory Storage, which utilises various aspects of manufacturing process, system control, machine vision, human machine interface, database implmentaion, production control system, mechanical mechanism design, and electrical design. Lead and manage the development and implementation Remote Production Control System for Semiconductor Equitments.

Software Engineer
Canon Machinery (m) Sdn. Bhd.
Aided in designing and developing customized system control software for semiconductor Die-Bonding Equitments based on various manufacturing processes of semiconductor fabricator customers. Technical support and system debugging for semiconductor automation system including mechanical process control system, machine vision and human machine interface. Designed and developed control software in an improvement-oriented cross department project, that resulted 5% UPH increment, 40% reliability improvement in control mechanism for a specific semiconductor Die-Bonding Equitment product line.
Education
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