Spherosa Teng

. 负责高阶半导体清洗设备,12吋单片清洗设备 工艺开发 2.企业技术市场与公司未来技术路线战略 3.客户端技术市场需求对应 4.企业预研路线制定 5.提供开发建议与市场评估与分析 6.负责7nm 以下技术节点 高阶单片清洗设备与晶圆清洗工艺的开发

Design and develop the wet etching equipment, metal plating systems ,electroless plating systems,wet etching,cleaning systems. patent analysis patent tech design patent management Patent writer Dept process improved production program management

Project management and IP federation

Executing and Planning the large project of GOV, it is related of Textiles with ULTRASONIC WELDING and ADVANCE MANUFACTURING Technology Development Program, TDP R&D Organization TDP Industrial TDP The Business Innovation TDP The Academia TDP A+ Industrial Innovation R&D Program SBIR Small Business Innovation Research (SBIR) Consulting the customer service and training Patent mapping and portfolio Marketing Analytic and Federation Strategy formulation Develop of the technology with ultrasonic welding Marketing Analytic Technology planner Corporation service Project management Patent portfolio

I using the electrochemical machining(ECM) technology to develop the electrochemical etching to establish the key issue with [advanced manufacturing technology of produce the3-D Silicon Pattern] and [ Rapid advanced manufacturing technology and machine development of ECM-ETCH to assist Silicon dicing].And I also be responsible for the patent portfolio and patent development.