shengwen zhou

Yield Engineer

About

• Self-motivated researcher with solid interdisciplinary knowledge in physics, material science and electrical engineering. Well-trained in semiconductor theory and statistical analysis • Clean room experience in semiconductor device fabrication and processing including Physical Vapor Deposition (PVD) (e.g. sputtering, thermal evaporation), Chemical Vapor Deposition (CVD), Photolithography, E-beam Lithography, Wet Etch, Dry Etch (e.g. Plasma Etch, Reactive-Ion Etch), Mechanical Exfoliation, Spin Coating, and Lift-off • Five years hands-on experience in mechanical, optical and electrical characterization of materials via SEM, TEM, AFM, KPFM, XRD, SPCM, Raman and Photoluminescence • Excellent verbal, writing and communication skills developed through teaching experience, weekly group meetings and collaborations with the equipment suppliers

Country

City

China

Industry

Semiconductors

Skill

Semiconductor Fabrication, Material Characterisation, Nanotechnology, Chemical Vapor Deposition (CVD), Sputter Deposition, Scanning Electron Microscopy, AFM, TEM, Electron Beam Lithography, Photolithography, Plasma Etching, Reactive Ion Etching, Wet Chemical Etching, Raman Spectroscopy, Photoluminescence, Python, Matlab, COMSOL, Microsoft Office, Microsoft Word

Experience

Yield Engineer

NIICAM

2020-12 - Present · 5 yrs 10 mos

China

Sr. Application Engineer

ASML-Hermes Microvision

2018-7 - Present · 8 yrs 3 mos

Boise, Idaho Area

Research Assistant

Washington State University

2015-8 - Present · 11 yrs 2 mos

United States

• Synthesized high-quality and large-scale two dimensional material (In2Se3) thin film using CVD and PVD method, optimized the process conditions such as temperature, pressure, substrate material • Developed the device fabrication processes (Sputtering, E-beam Lithography, Photolithograph, Plasma Etch, Reactive-Ion Etch, and Thermal Evaporation), significantly improved the device yield and performance • Conducted the thermal, mechanical and electrical characterization (Raman, SEM, TEM, SPCM, PL and KPFM) of the semiconductor device to explore its potential applications in photovoltaics, optoelectronics and phase change memory • Carried out the laser heat transport simulation of semiconducting thin films in COMSOL, fundamentally interpreted the limiting mechanisms for 2D thermal transport. • Analyzed experimental data by PYTHON, including data cleaning, data smoothing and regression analysis • Performed inspection and maintenance of the equipment in laboratory on daily basis, effectively collaborated with the equipment suppliers to solve technical problems • Provided laboratory supports for other research groups

Teaching Assistant

Washington State University

2012-8 - 2015-8 · 3 yrs 1 mo

United States

• Taught several physics laboratory, created a positive atmosphere for the students to help them understand concepts, build model, set equipment, collect and analyze data • Assisted the instructors in developing class instructions and preparing exam papers for the undergraduates

Research Assistant

Dalian University of Technology

2010-7 - 2012-5 · 1 yr 11 mos

China

Conducted government funded college students’ innovative project • Designed and built a CVD system, optimized the CVD process for the synthesis of Carbon Nanocoils (CNCs), improved yield, purification and coil diameter of CNCs • Characterized the microwave absorption properties of CNCs and paraffin composite, demonstrated its performance advantages for broad-band microwave absorber

Research Assistant

Dalian Institute of Chemical Physics, Chinese Academy of Sciences, China

2011-6 - 2011-9 · 4 mos

China

• Carried out QCT calculation for three-atom reaction (H+OCI→OH+CI) • Investigated collision-energy-dependent effects on chemical stereodynamics by calculating the reaction probability and the integral cross section, provided a comprehensive understanding of the reaction system mechanism

Materials Engineer

Dalian Guangda Technologies Inc.

2011-4 - 2011-6 · 3 mos

China

• Worked in optical fiber assembly line, cleaned, cleaved optical fibers. Assembled and packed optical components to meet client's requirements • Performed data analysis and reported the results to the Technical Department