shengchun ding

Principle Engineer @ InnoLight Technology

About

1. 5+ years Optical Communication product development experiences, involved products including 25G/10G/100G/400G Transceiver and OSA Modules. Such as CXP、QSFP28、QSFP 4x LR、10G/25G SFP+、100G EDR、CFP4. 2. 7+ years experiences in Optical Communication/Semiconductor process platform development, involved processes including: SMT, Die Attach, Flip Chip, FCP/CSP Underfill,IC/Chip Encapsulation、Active Lens Alignment. 3. 5+ years experiences in Cross Functional Team work, involved departments including Product/Process R&D, NPI, and ME. 4. 3+ years experiences in Optical Communication advanced packaging technology/process development, involved package method including Chip on Flex/Chip on Board/Chip on Glass/Chip on Silicon. 5. 2+ years team Building/Management experiences. 6. 7+ adhesive technology/process development/failure anlysis experiences, involved adhesive including UV/Thermal curing Epoxy, UV curing Acrylic and Silicone.

Country

City

China

Industry

Telecommunications

Skill

Engineering, Product Development, Manufacturing, Cross-functional Team Leadership, Management, Semiconductor, Failure Analysis, Adhesive Application, 故障分析, 工艺过程, SPC, 半导体行业

Experience

Principle Engineer

InnoLight Technology

2017-3 - Present · 9 yrs 7 mos

苏州

Sr Process Eng

Finisar Corporation

2013-6 - 2017-2 · 3 yrs 9 mos

Zhangjiang,SHG

1. As an Adhesive Process Development Leader, set up an adhesive process development team that responsible for the new product adhesive selection and process development. The involved products including 10G/40G/100G Transceiver/OSA modules, detailed process including Solder Paste of SMT Paste, Silver epoxy of Die Attach, Underfill of Flip Chip, Encapsulant of IC/Chip Encapsulation, Structure Epoxy of Active Lens Alignment, etc.. 2. Established an Adhesive Analysis Lab that could verify the key parameter of adhesive like the Tg, CTE, hardness, viscosity,filler content and degree of cure. 3. Set up an adhesive failure analysis team, responsible for adhesive related failure analysis of all product during R&D/NPI/MP phase. 4. Build up an adhesive database(100+ Categories adhesives) that including UV/Thermal curing Epoxy, UV Curing Acrylic and Silicone, covered Passive/WSS/Transceiver/OSA products. 5. Established Adhesive Management System, involved Adhesive Receiving, Storage, Distribution, Thawing, Application and Recycling that make sure adhesive was completely controlled.