Shaoning Yuan

o Provide optical critical dimension (OCD) advanced metrology solutions for cutting-age semiconductor fab or foundry including 3D Logic (including GAA devices), Dynamic random-access memory (DRAM), 3D vertical NAND (V-NAND) technology; o Collaborate with customers and manage manpower/resources from local and global sites; o Conduct training for customers and junior application scientists

Worked as senior engineer in Technological Development department (TD-ITD\Logic1): o Process integration of 40/45nm, 55/65nm 12 inch wafer process (Logic devices); o Prototype customer devices and demonstrate functionality of initial products; o Drive developmental activity of new generation products, such as Through Silicon Via (TSV);

 Control multi-stack thin film process of 2.5 inch hard disk plates based on Anelva C-3040 (PVD/CVD);  Setup new production line based on Anelva C-3040, conduct equipment adjustment/process evaluation ;  Quality improvement and trouble shooting.

 Phase change RAM (PCRAM) research project: --Deposit/chracterize GeSbTe (GST) based thin film materials and test GST based PCRAM;  4th generation DVD research project: --Design and setup the computer controlled Static tester for MDML (multi-dimensional multi-layer) disc; --Study and establish the computer controlled MOKE (Magneto-Optical Kerr Effect Tester) and result testing.  Holographic data storage research project: --Design and setup the tester for photorefractive effect and holographic data storage; --Grow/characterize LiNbO3 based photorefractive single crystal; --Crystal growth methods: Bridgeman, Czochralski, TSSG, LPE;