Seye Ha

RF PCB Engineering Specialist @ HighPCB

About

Designing an RF circuit is only half the battle; manufacturing it without signal loss is where the real challenge begins. At HighPCB, I specialize in the critical details of RF and high-frequency PCB manufacturing that don’t show up in initial designs but absolutely matter in real-world performance. My goal is to help hardware engineers ensure signal integrity, optimize impedance matching, and prevent costly design-for-manufacturing (DFM) failures. Whether it’s selecting the right advanced materials (like Rogers or Teflon) or navigating strict IPC standards, I bridge the gap between complex RF design theory and flawless PCB manufacturing reality. 🔹 Core Focus Areas: High-Frequency PCB DFM | Impedance Control | RF Signal Integrity | Advanced Material Selection | Cross-Functional Problem Solving.

Country

China

City

Shenzhen

Industry

Consumer Electronics

Skill

Signal Integrity Analysis, Design for Manufacturing, High-Frequency PCB Design & Manufacturing, RF Circuits, RF & Microwave Design, Radio Frequency (RF) Engineering, PCB Assembly, Direct Sales, Printed Circuit Board (PCB) Design, Printed Circuit Board Manufacturing, Strategic Planning, Open Innovation, Enterprise Resource Planning (ERP), Feasibility Studies, Knowledge Management, Project Management, Business Planning, ISO 9001, JIRA, Crowdsourcing

Experience

RF PCB Engineering Specialist

HighPCB

2016-2 - Present · 10 yrs 8 mos

Shenzhen

As an Electronic Specialist focusing on High-Frequency PCBs, I ensure that complex RF and microwave board designs translate perfectly into highly reliable manufactured products. 🔹 Key Responsibilities & Achievements: ● RF PCB Manufacturing Optimization: Specialized in the Design for Manufacturing (DFM) and production requirements of high-frequency and High-Density Interconnect (HDI) boards. ● Impedance & Material Consulting: Advised engineering clients on optimal material selection (e.g., Rogers, Teflon, specialized FR4) and layer stackup designs to maintain strict impedance control during manufacturing. ● Bridging Design & Production: Acted as the crucial link between RF design engineers and factory-floor realities, significantly reducing prototype iterations and preventing costly production delays. ● Signal Integrity QA: Collaborated with quality control teams to ensure final fabricated boards meet rigorous signal integrity and IPC Class 2/3 standards.