Sean Lee

Lead key account sourcing team for advanced and mature technology nodes in semiconductor wafer manufacturing, managing multi-billion-dollar annual expenditures. Accelerated new generation products ramp-up and time-to-market, ensured long-term capacity supply, and implemented a significant year-over-year cost reduction roadmap. Facilitated CEO and executive-level communication, strategy development, and alignment. Fostered cross-functional collaboration with Project Management, Engineering, Quality, Supply Chain, Legal, Finance, Business Units, and subsidiaries. High ranked leadership by Employ Experience Survey

Sourcing Lead of Logic, RF Front End and Power Amplifier product chips. Successfully ramp up 5G by cross functional team work (BUs, supply chain, technology, engineering and quality) toward 5G products on time delivery, yield improvement, cost reduction, supplier cycle time and capacity commitments. Managed > $1.5B/year spending and achieved >15% year over year cost reduction by supplier strategy development and execution. Successfully bring up new supplier throughout business/legal process, engineering qualification and mass production ramp. Partnership suppliers: Taiwan Semiconductor Manufacturing Co. (NYSE: TSM), United Microelectronics Corp. (NYSE: UMC), WIN Semiconductors Corp. (TWSE: 3105) Hosts executive level quarterly business review toward long-term strategy and goal alignment, engineering improvement, cost reduction roadmap and supply chain management.

Managed global (U.S., Germany and Singapore) procurement team to develop and execute Lithography / Wet Etching equipment sourcing strategy, annual spending >$1.3B. Successfully reduced >20% lithography equipment total cost of ownership by capital/expense cost reduction, tool performance enhancement, and parts consignment projects with cross functional teams (Engineering, Quality, Process Yield, Capital Efficiency). Achieved New York fab 21.5K wafer out per month on time ramping. Strategic supplier management champion of ASML (NASDAQ: ASML), Tokyo Electron (NASDAQ: TOELY), Dianippon Screen (NSADAQ: DINRY), and Nikon (NASDAQ: NINOY). Managed monthly tool/supplier performance review, semi-annual business reviews and CEO level global business review. Coordinator of 2014 Global Supplier Day. Led 8-member core team for 2-day supplier event toward corporate goal alignment, strategic supplier management, supplier awards and relationship maintenance. Event was highly recognized by CEO, leadership team and supplier executive

Technical Manager, Production Equipment Procurement (Jun’09~Sep’11) Lithography capital purchasing team leader: - Led 3-member team for supplier strategy development, capital planning execution and supplier relationship management. Annual spending over $1.2B, achieved price and total cost of ownership reduction greater than 20%. - Supplier management for ASML, Nikon, TEL, and DNS. - Responsible for used equipment sourcing and refurbishment projects, over $20M saving. Principle Purchasing Specialist, Production Equipment Procurement (May’07 ~ Jun’09) Project owner of “R&D Early Engagement”: - Drove R&D tooling evaluation and selection strategy including early TCO reduction project. - Resulted in 28% of R&D capital spending reduction in 2 years (2007~2008). Diffusion and Lithography equipment procurement champion: - Responsible for equipment price negotiations, slot delivery accuracy, supply chain and relationship management for TEL, DNS, Hitachi, ASML, and Nikon. Achieved annual savings of 10% to 15%.

R&D and Production Line Planner.Fab12 Manufacturing Department (May’04~May’07) • Received 2006 TSMC TQE (Total Quality Enhancement) Award for mass production cycle time reduction and on time delivery improvement project. • Developed production line dispatching strategy and executed fab ramp plan to ensure 100% production delivery ship rate. • Received 2005 TSMC Engineering Contribution Award for Delivering 65nm R&D schedule 3 months ahead of plan. The fastest 90nm Super Hot lotcycle timerecord. Received over 10 thank you letters from customers. Production Line Supervisor, Fab 12 Manufacturing Department (Apr’02 ~ May’04) Project lead: - Re-built Control Wafer Management System infrastructure and achieved $15M saving/year. Team received 2004 TSMC Engineering Contribution Special Award” Production Line Supervisor: - Managed 40 operators for CVD, PVD, CMP production line to achieve production goals.

• Corporal (2001~2002), Responsible for new recruit training and clarinet team management. • Private (2000~2001), clarinet team member

M.S., Industrial Engineering and Management Papers: (2000) A Study on the Use Behavior of Aviation Automation on Advanced Aircrafts http://handle.ncl.edu.tw/11296/ndltd/13055272514301814161 (1999) Human Factor in Aviation. Taiwan Civil Aviation Journal Quarterly, 3（2），p15-42

Major B.S., Psychology Minor B.S., Industrial Engineering