Sams Hsu

Response for all of Brooks product sales include. In charge of UMC and Formosa account sales from 2008 to now. In charge of PSC, Rexchip, Winbond and backend fabs account sales. In charge of OEM (LAM/Novellus/Varian/AMAT) account sales and co-work with OEM on service and sales project. Sell all of Brooks’s new products and service package to customers. Sell service contracts to customers and provide Brooks value and advantage to customers. For new sale portion: Sold reticle inspection tool to Inotera. Sold 200mm and 300mm platform to Taiwan local OEM and keep have repeat order. Sold lots VPD products (Pump and Gauge) to Taiwan local OEM which included semiconductor field and non-semiconductor. Sold platform (200mm and 300 mm) to local OEM maker. Sold CTI pump to local for 20 nm process application. For Service portion: Sold pump service contact to Winbond Had 3 years pump service contract with UMC group: Around USD 2M per year. Had robot 3 years price contract with UMC Group: Revenue contribution around from USD 200 K to 600K at least per year from 2008 to 2010. Revise Price agreement on robot repair portion. The revenue will expect more than 25% increasing in 2011 compared with 2010. The price will keep until to 2013. Sold reticle stocker service contract with PSC and Maxchip: USD 140K per year. Sold robot price agreement with Inotera and NanYa : Revenue contribution around under USD 50K to 250K at least in 2010. Sold 3 years pump service contract in Winbond Fab 2: USD 50K per year. Will have 2 years pump service contract with Inotera and NanYa: USD 1.5M per year. Sold 3 years pump contract to Formosa total amount is USD 5.5M. Take care OEM account from 2012 to now: Keep good relationship with OEMs account. Find opportunity from local OEMs. Develop new OEM customers in Taiwan. Had a service contract with OEM.

Response for CD-SEM and film measurement (FX series) tool service Had KLA service engineer Level 3 certification on CD-SEM and FX system. To be tsmc account service engineer and in charge service on tsmc F8 and F12.

Response for Ion implanter service and process includes: Join Hermes investment AIBT develop Ion Implanter(iStar) plan and test, and have the first installbase in UMCi. Study on shallow junction process (90nm application). Study on RTP process. Radiation of divergence safety certification 1 year service engineer and 3 years process engineer. Hermes-Epitek was the biggest agent which had more than 1000 employees in worldwide; I joined ion implanter team (AIBT) and went to San Jose to join the first tool final acceptance and improvement. Also we succeeded the first demo tool penetrated to UMCi. Currently AIBT team had more than 18 tools in past three years. Reason of Quit: Learn more semiconductor filed tool. Name of company: KLA-Tencor (2004 April to 2006