Ryan Ng Wee Liong .

• Quality section head of a system assembly factory, responsible for the quality aspect from NPI to EOP phase of Apple products (fluent in both English and Mandarin). • Main communication window with external customers from USA/Vietnam/China/Malaysia/Singapore (in both English and Mandarin fluently). • Co-work with external customers to execute and enforce all quality related tasks within the factory, to ensure the product's quality at the highest level possible. • Establishing Product Quality Plan (PQP) with customers, including ORT test plan, IPQC/OQC/CQA sampling plan, site qualification plan, line qualification plan, and set up multiple quality specs such as CTQ Dimension MSOP, Kappa/FIT process, cosmetic spec, etc. • Liaise with the internal cross-functional quality team and labs (QE/IQC/IPQC/OQC/CQA/REL) on the quality readiness preparation, and quality tracking such as incoming material quality check, in-process quality check (cross-section/X-Ray/In process CTQ measurement/quality audit/etc.), Outgoing Quality check (cosmetic and user functions check) and Ongoing Reliability Testing. • Led and managed a cross-functional task force team for any Quality-related issue investigation (Customer Complaints/Return/Quality Notice/ORT failures/etc.) via data analysis, DOE, FACA (Failure Analysis and Corrective Action) or 8D. • Receive quality customer visits and prepare the relevant documents. • Responsible for the recruitment of team members and internal training.

• Led a team of professional engineers, in charge of new product (Optical Transceiver Modules) introduction and qualification, process and product improvement activities, yield improvement activities etc. • Key contact person for customers from Singapore/Malaysia/China (in both English and Mandarin fluently), execute projects based on timeline and resource planning, to ensure all milestones are met and customer’s requirements are well satisfied. • Main DRI for product management from NPI to EOL, create and manage BOM, handling Engineering Change Notice (ECN), material/product import and export, miscellaneous DOE for process improvement, external and internal customer complaints, 8D, outgoing product inspection and packing setup etc. • Responsible and involved in receiving customer visits, line tours, customer audits, internal KPI management etc.

In charge of process development within Plasma Dicing process module. Actively involved in development and evaluations related to the Plasma Dicing process module (Plasma Etching and Post-Plasma-Etch Cleaning processes).

Six years of experiences in NPD/NPI (6 & 8in and Foundry), responsible for new product (discrete device) development, qualification, and production release Experienced in project management, DOE & problem-solving. Possess decent knowledge regarding Semiconductor Wafer FAB manufacturing processes and process integration.