Renda Song

Diffusion & Implant Manufacturing Process Controller (MPC) @ SK hynix

About

After graduate from master, I join semiconductor manufacturing industry, which I think stands for human highest technology. During my job I acquire people management and wafer manufacturing management. I really cherish the knowledge learn from semiconductor industry area. And willing to broaden more prospective. I want to join worldwide top semiconductor company and make something wonderful to the world. As DIFF&IMP manufacturing operation engineer, I need deal with daily operation assessment, like tool Utilization loss, layer release, lot cross fab distribution management, etc. Also, need do routine analysis of area WS performance, and dig out efficiency improve opportunities. Under pressure and high speed work environment, I not only acquire how to communicate with different area stakehold, but also find some suitable to satisfied me to love my job. All in all, I like semiconductor industry, the reason why I want a job outside China is I want to broaden my perspective, and know much more interesting technologies, even though as industrial engineer, I can just understand basic operation logic, but that`s enough to me.

Country

China

City

Liaoning

Industry

Semiconductors

Skill

Semiconductor Fabrication, Semiconductor Industry, 3D NAND process flow, New product introduction (NPI), Cycle Time Reduction, Capacity Planning, Operation Efficiency Improvement, Equipment Utilization Improvement, Manufacturing Operation Summary, Issue workstation highlight logic buildup (MA/U/WSE/IDLE), Tool Loading Forecast & Recipe Release Arrangement, Forecast of Future Bottleneck Workstation - Base on Quarter Fab outs, Manufacturing Recipe Request tool count - SQL, Wafer Incoming Forecast - SQL, Tool Design for manufacturing recipe request tool count - SQL, Cost saving project - bag & unbag tool, Spacing knowledge of Equipment Preventive Maintenance (PM), Environment, Health, and Safety (EHS), Excel Pivot, Fabrication summary

Experience

Diffusion & Implant Manufacturing Process Controller (MPC)

SK hynix

2025-3 - Present · 1 yr 7 mos

Dalian, Liaoning, China

Fulfill the deal of Intel sale 3D NAND business to SK Hynix. 1. AI manufacturing direction. Use SQL forecast “dynamic wafer movement”. Study root cause of historical movement failure, then use machine learning result to forecast future process flow performance. 2. AI operation management. Use SQL calculate out operation layer request tool count which base on wafer incoming and line flexibility request. Do pre-active operation mapping. And real time detect layer release gap. 3. PM spacing. Use SQL to build Diffusion process counter calculation tool. Detect potential future PM overlap to bypass huge capacity drop. 4. CQT advance management. Mapping 5 distinctive product CQT setting, detect out abnormal setting caused cross product layer priority difference. Co-work with PIE for CQT setting optimization. Standarize CQT management guideline and co-work with team member execution.

Diffusion & Implant Manufacturing Process Controller (MPC)

Intel

2023-6 - 2025-3 · 1 yr 10 mos

Liaoning, China

1. New product introduction (NPI) management. Standardize NPI procedure, tracking tool installation & dismantle and summary Diffusion new product process logic. Base on new product run rate, prepare recipe release and assess cycle time impact for current main product. 2. Cost saving and capacity planning. Base on wafer fab outs goal, arrange equipment bag/unbag schedule. Maintain bag tool list and conversion opportunity list, trigger emergent unbag & conversion when face equipment hard down. 3. Whole factory yearly health check. Support fab stop & restart capacity planning, co-work with PIE choose DIFF & IMP upstream process safe step for wafer parking, align with PE about lock and release tool schedule, track real execution and summary project learning. 4. Quality management. Focus on wafer critical quality time (CQT), do timely update when yield & line priority triggered change. Co-work with routine ISO9001 audit, modify team internal CQT execution procedure. 5. Wafer cross fab transportation management. Manage over head vehicle (OHV) cross fab transport wafer, lead recipe cross fab process qualify, audit transport time, and timely stop line at safe step when face critical tool hard down. 6. Availability and Utilization management. Use SQL and EXCEL pivot chart to do data analysis, seek efficiency and utilization improvement. 7. Pressure resistance. Serve 7*24h on call, response for emergent case. Negotiate cross team and deliver expected result.

Thin Film Shift Group Leader

Intel

2022-7 - 2023-6 · 1 yr

Liaoning, China

1. Wafer outs management. Early detect process issue and make sure shift wafer outs meet goal. 2. People management. Arrange 21 employees resource for SACVD/PECVD. Develop cross tool type training plan. 3. Equipment management. Understand tool structure and action plan of SACVD/PECVD. Lean management of clean room space usage. 4. Emergency response. Ceritify by EHS about emergency response. Such as fires, gas leaks, cardiac resuscitation, etc.