Paul Huntoon

Provided the engineering team with tools to successfully implement new customer products. Developed and coordinated with Customer Focus, Test and Manufacturing Engineering teams the plan to launch from pilot to sustainment, products from PCBA to final unit build assembly. Applied sound project management skills in the areas of Risk, Resource, Time, Quality, Communication and Procurement Management. • Lead new project management activities from rapid prototyping, quoting labor, developing process routing, visual aids and manufacturing layout for multiple medical and industrial products. • DFM processing using Valor and Silicone Expert product life cycle software. • Led multiple continuous improvement activities using 6-sigma DMAIC processes including project of the year finalist for Process Improvements of >$250,000 a year in savings. • Customer ECO processing using GCS and PLM7 including numerous transactions in SAP. • Multiple equipment acquisitions and implementations from customer owned to new technologies. • IQ, OQ and PQ processing including developing test method validations. • Worked closely with Production Supervisors, Quality Engineering and the Customer to review and monitor quality yields, daily issues and process improvements • Planning trips to customer sites within and outside of the US to create product transfer timelines and develop detailed production plans for transfer of work.

• Training of SMT, PTH, Chip Scale Packaging and PCB assembly process. • Equipment evaluations, cost justifications and implementations for SM, SPI, AOI, Selective Solder, Printing, Wave, Coating, Laser Marking, X-ray and other automated processes. • Prototyping, New Product Introductions NPI and develop Design for Manufacturability DFM guidelines for prototyping and improved customer designs. • Training in SM stencil technologies, printing theories, Gerber modifications and design, stencil ordering, advanced aperture design, pin-in-paste and preform applications. • Advanced BGA and solder joint analysis using 3d x-ray inspection and cross-sectional tools. • BGA & micro-BGA development/rework, DoE, and destructive testing. • BGA tensile strength and die/pry test for failure analysis of BGA pad ratio design. • Testing for flux residue detection under low standoff devices and PCB contamination identifying. • Recognized expert in cleaning processes (inline, batch, ultrasonic and vapor phase), contamination and chemical analysis using ROSE, SEM, optical microscopy, FTIR, and 3rd party resources. • Thorough understanding of RoHS, WEEE, IPC, J-STD’s, JEDEC and MIL specifications. • Multiple industry contacts in all phases of processing including several manufacturing representatives, equipment field service engineers, chemists, local engineering colleagues, and SMTA & IPC members. • Proficient with the following software packages: Oracle, Agile, Confluence, Jira, ADP, PC/MRP, Unisoft suite, Graphicode suite, GerbPad, Koh Young ePM, AutoCAD, Solidworks, LabVIEW, Aegis CircuitCam, MS Office, Access, FilePro, NetTerm, MyLabel, MyPlan, MyCenter, Spreadsheet and Database Structures, BOM formatting, CAD and equipment interfaces. • Experienced with ITAR, import and exporting, ZOE, HTS Codes, and US Customs regulations. • Development and operation of Mexico CCA production facility with over 6 years commuting across US borders.

Managed a team in the development and manufacturing of the world’s first practical solid-state cooling and power generation system. The technology is based on distributed, solid state, thermoelectric devices allowing a cooling and warming functionality to be integrated into seating, bedding, wearables and more. The technology provides a highly efficient means of heating and cooling people conductively. • Setup manufacturing operations in Agua Prieta, Sonora, Mexico as a shelter. • Designed and develop the manufacturing processes to supply the high volume automotive market. • Purchase, qualify ERSA VF-3/45 high volume selective solder process. • Led the design and developed of multiple automated manufacturing cells including multiple sub-process automation and development projects. • Fixture design, process layout and automation design using Solidworks (4 years) and AutoCad (15 years). • Manage the purchase, qualification and implementation of SMT and Selective Solder production lines with equipment such as; DEK, Mydata and Heller, ERSA, YesTech and Koh Young 3d AOI. • Led software and hardware development using National Instruments LabView and VB packages. • Traceability system developed included live yield reporting with metrics, defect database pareto charts, product history, traveler, Cpk and Ppk charting. • ISO-9001:2015 certification team for Mexico facility including documentation, presentation and audit preparation for supplier audits and future IATF-16949:2016 certifications. • Process verification of AIAG standards for implementation within our manufacturing to include APQP and PPAP quality standards used within the automotive industry. • AIAG CQI-17 Soldering System assessment auditor. • Development of Automation and Capacity Plan Roadmap, Engineering Milestones, and Technology Roadmaps including an overall plan in the reduction of product cost. • Multiple manufacturing trade secrets and patents pending on product concept and design.

Engineering responsibilities include researching, evaluating and implementing new equipment. Upgraded manufacturing operations to be consistent with current, advancing and new technologies. Develop programming and processing documentation for entire assembly process. Provide technical support and machine repair when production equipment is down. Assist with the implementation of Lean activities and continuous improvement programs on a daily basis. • Upgraded SMT production to include AOI, x-ray and automated printing processes under budget at 70k. • Developed and implemented company-wide predictive and preventative maintenance program. • Implementation of post SMT and final assembly AOI, x-ray and automated stencil printing processes. • Increased first test pass yield from 83% to 99.8% by implementing final assembly AOI process. • Developed and implemented work instructions and quality procedures for all equipment programming, maintenance and operation. • Offline programming implementation for Mydata, ACE Selective Solder and Yestech AOI. • Implemented Op Sheets, ECO, ECN, BOM changes, Red Line drawings and multiple WIs and QPs. • Standardized NPI launch and prototype processes to include DFM guidelines and feedback. • Developed and implemented training courses for Mydata, AOI, X-ray, Selective Solder and DEK. • 2014 Copper Cactus award recipient for small business growth.

Process Engineer and Manager that synergized and integrated using Six Sigma strategies, analytical insight, technical discipline, continuous improvement, process metrics and business knowledge to solve problems. Skilled engineer and mentor that increases productivity and efficiency by coaching and directing a strong engineering team. • Managed entire development and launch of electronics assembly facility in low cost region (Mexico). • Designed layout and process flow of multiple automated assembly lines and production cells. • Successfully implemented multiple SMT lines that included total project management and installation at an average equipment cost of <1MM per assembly line. • Prepared and successfully implemented AS9100B:2004 registration at Mexico facility (Perry Johnson). • Achieved continuous cycle time reductions through monitoring DPMO, determining root cause and implementing measurable corrections. • Responsible for performing time studies, cost evaluations, and return on investments. • Trained and evaluated operators, technicians and engineers in manufacturing assembly applications, equipment operation and troubleshooting including IPC and J-STD specifications. • Participated and lead Kaizen events achieving significant cost reductions, yield improvements, process flow and floor space reduction objectives. • BOM, ECN/ECO generation & implementation. • Development and implementation of bare board array DFM, PCB qualification / inspection and cross sectional analysis procedures. • Conducted DoE on components and PCB’s for failure analysis projects. • Extensive research in cross-sectioning, BGA voiding, and in-depth x-ray failure analysis. • Management and customer support for production/process problem solving and FA. • New product launch & developing manufacturing plans while optimizing/maintaining process flow. • Designed experiments to reduce process variation (Gage R&R) and performed Cpk limitations.

Support, implementation and training for Boeing 737, 777, and 737 Next Generation aircraft wiring production cells.