Paul GOND-CHARTON

Senior packaging specialist @ Anyon Systems Inc.

About

With my general knowledge obtained through my degree in physics engineering, I chose to get a speciliazation into the dynamique microelectronic domain. I evole through this domain for the last 10 years developing and enhancing many microfabrication processes. R&D enviromnent and physical and chemical phenomena implementation are two strong drivers to my motivation.

Country

Canada

City

Bromont

Industry

Research

Skill

Fabrication de semi-conducteurs, Méthodologies Agile et Waterfall, Microfabrication, Microélectronique, MEMS, Travail d’équipe, Rigeur, Salle blanche, LaTeX, ImageJ, Génie mécanique, Analyse de risques, Amélioration continue, Capex, Maîtrise statistique des procédés, Approvisionnement, Cahier des charges fonctionnel, Technique de résolution des problèmes 8D, Packaging microélectronique, Réalisation de tests

Experience

Senior packaging specialist

Anyon Systems Inc.

2026-5 - Present · 5 mos

Бромон, QC

- Advanced 3D packaging process development for supraconductors dies - Characterization and test of quantum packages

Optoelectronic R&D scientist

IBM

2022-5 - 2026-5 · 4 yrs 1 mo

Bromont, Québec, Canada

- Innovative assembly solutions for optoelectronic components - Advanced optical components specifications - Optical test (insertion and reflexion losses) - 2 technical publications and 1 patent - Data science

Microfabrication scientist

Teledyne DALSA

2017-5 - 2022-5 · 5 yrs 1 mo

Bromont, Quebec, Canada

- Tool responsible for 200 mm equipment (polishing - CMP-, WtW bonding and dry lift-off) -150 and 200 mm silicon wafer specification responsible. - New process development (CMP, eutectic bonding, low temp plasma activated bonding, dry lift-off, grinding...) - Integrator for CMOS BSI sensor on 200 mm wafer - Technology and process transfer - Statistical Process control (SPC), Problem solving methodoly 8D, 5 why's, Fishbone and PFMEA - Familiar with 6 sigma quality and Cpk especially for automotive customers - New tool specifications, financial justification, cost evaluation in production and production capacity evaluation - New project evaluation. Risk analysis and Capex. - 3 technical publications

Post-doctorant student

Université de Sherbrooke

2016-6 - 2017-5 · 1 yr

Sherbrooke, Quebec, Canada

- Au-Au low temp WtW bonding integration and characterization for MEMS encapsulation - CMP recipe development for in-situ doped polysilicon - Cu-SiO2 hybrid technology transfer for 3D MEMS/ASIC application - 1 technical publication

PhD candidate

CEA

2012-10 - 2015-10 · 3 yrs 1 mo

Grenoble, France

Dissertation title : "Direct wafer bonding integration : Metal thin films and morphological evolution" - Process development in cleanroom environment - Advanced technical knowledge in 3D Integration & Packaging - Bibliographic research, technological watch and patent strategy - Collaboration with various institutes and companies - Oral and written communication of research results - Supervision of an internship (Master level) - 7 technical publication - 8 patents - 4 international conferences

Research engineer - Internship

CEA

2012-2 - 2012-7 · 6 mos

Grenoble, France

Research topic : "Process development of copper-copper thermocompression wafer bonding" - Process development in a cleanroom environment - Bibliographic synthesis - Morphological characterization - Oral and written communication of research results - 1 technical publication and 1 patent

Engineer - Internship

TechnoPieux 63

2011-5 - 2011-8 · 4 mos

Clermont-Ferrand, France

Sizing, implementation and optimization of metallic screwed foundations - Mechanical design (sizing and drawing) - Construction project management (2 teams) - Supply management - Regular contact with clients and suppliers